3035 Faraday Technology Corp.

Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service

Faraday Technology Corporation (TWSE:3035), a leading ASIC design service and IP provider, today announced its FPGA-to-ASIC conversion service has successfully completed several AI related projects including drone vision, medical image analysis, smart appliances, and 3D sensing. It brings remarkable power saving, enhanced performance and lower system cost to meet the specific AI requirement.

Faraday’s FPGA-to-ASIC conversion service, in conjunction with comprehensive IP solutions of PCIe Gen 3/4, MIPI D-PHY, DDR3/4 and SerDes 12/16/25/28/56G at advance FinFET process nodes, are particularly suited for AI chips requiring higher bandwidth and a lower latency interface. From cloud to edge computing, in applications like machine vision, NLP, and sentiment analysis, Faraday can deliver optimized ASIC chip designs featuring 30~100 times better energy efficiency.

With 25 years of IP development experience, Faraday has the ability to customize IPs for ASIC cost efficiency in mass production. Faraday has handcrafted SRAM macros allowing for a reduction of on-chip SRAM area by 5~50%, in addition, its SRAM Redundancy & Repair design feature increases yield rates by up to 10%.

“As AI algorithm mature and the market demand for AI products rise, customers look to replace FPGA chips with ASIC devices for a competitive system BOM cost. Faraday’s ASIC service has been validated in thousands of designs and shipped hundred millions of market proven SoCs. The service provides AI customers with a path to lower integration risk and cost, accelerating the adoption of new DNN algorithms”, said Flash Lin, COO of Faraday Technology.

About Faraday Technology Corporation

Faraday Technology Corporation (TWSE: 3035) is a leading ASIC design service and IP provider, certified to ISO 9001 and ISO 26262. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, USB 2.0/3.1 Gen 1, 10/100/1000 Ethernet, Serial ATA, PCI Express, and programmable SerDes, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China. For more information, visit www.faraday-tech.com or follow Faraday on LinkedIn.

EN
12/03/2018

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on Faraday Technology Corp.

 PRESS RELEASE

Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Ve...

HSINCHU, Taiwan--(BUSINESS WIRE)-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announces the launch of its latest SoC platform, HiSpeedKit™-HS, designed to enhance and streamline the verification process for high-speed interface IP subsystems. The platform supports Faraday’s and third-party controller IP solutions, enabling comprehensive hardware and software verification through FPGA integrated with HiSpeedKit-HS. The HiSpeedKit-HS platform allows interface IP verification thorough integration and testing within a realistic SoC environmen...

 PRESS RELEASE

Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Produ...

HSINCHU, Taiwan--(BUSINESS WIRE)-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed through collaboration between Faraday and Kiwimoore, which incorporates Kiwimoore’s Chiplet interconnect and NDSA (network domain specific accelerator) solutions, highlight the significant achi...

 PRESS RELEASE

Faraday Unveils Advanced Packaging Coordinated Platform for Multi-Sour...

HSINCHU, Taiwan--(BUSINESS WIRE)-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services - design, packaging, and production. In today’s chiplet era, the advanced packaging capacity is increasingly limited. Faraday’s new platform addresses this challenge by effectively coordina...

 PRESS RELEASE

Faraday Adds Video Interface IP to Support All Advanced Planar Nodes o...

HSINCHU, Taiwan--(BUSINESS WIRE)-- Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its MIPI D-PHY and V-by-One (VBO) PHY IP portfolios now support processes that range from 55nm to 22nm on UMC platform. Faraday has shipped over 100 million video interface IP solutions for AIoT, industrial, consumer, and automotive applications, which includes ASIC and IP business models. Faraday’s newly released MIPI D-PHY IP on 22nm features a low operating voltage of 0.8V, resulting in a 12% reduction in power consumption and a 10% decrease i...

 PRESS RELEASE

Faraday Joins Intel Foundry Accelerator Design Services Alliance to Ta...

HSINCHU, Taiwan--(BUSINESS WIRE)-- Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicles. This participation in the alliance underscores a shared commitment to innovation and customer success. Since its establishment in 1993, Faraday has been at the forefront, offering an extensive range of ...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch