KYOTO, Japan--(BUSINESS WIRE)--
Kyocera Corporation (NYSE:KYO)(TOKYO:6971) today announced that it has developed an ultra-small ceramic package utilizing a proprietary multilayer structure with a built-in RFID*1 antenna that can increase the read range up to 2X as compared with conventional packages of the same size. Starting mass production in May 2017, the product will be available worldwide in three sizes (from 6x3x1.7mm to 15x5x1.7mm), with an annual sales target of JPY 3 billion by 2020.
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Ceramic packages with embedded RFID antenna (scale showing 1.0mm increments) (Photo: Business Wire)
Kyocera’s proprietary technologies cultivated over many years in advanced ceramic materials and multilayer structures ensure a compact package with outstanding performance. The new ceramic package with a RFID antenna will help meet rising demand for RFID tags to support Internet of Things (IoT) applications.
| Product name | Ceramic Package with Embedded RFID Antenna | |
| Applications | Automotive, medical equipment control, factory automation and other industrial uses | |
|
External Dimensions |
6x3x1.7mm, 10x5x1.7mm and 15x5x1.7mm | |
| Frequency Band | UHF (860-960MHz) | |
| Production Facility | Kagoshima Kokubu Plant | |
Development Background
As production of IoT devices
continues to expand, RFID technology is expected to proliferate into the
automotive and medical industries, factory automation and many other
industrial fields — with a market expected to total JPY 100 billion
(approx. USD 900 million) by 2020*2. While packages utilizing
organic or resin-based materials will be utilized for conventional RFID
tags in common retail applications, many other applications will require
durable RFID packages with higher resistance to harsh environments such
as water, heat and chemicals, while still delivering greater read ranges.
Product Features
Up to 2X communication distance in the UHF band while maintaining
compact size
In UHF band*3 testing, this new
ceramic package with an embedded RFID antenna provided a read range
between 1.5 and 2 times that of conventional RFID tags of the same size.
Even as package size decreased, the Kyocera low-profile thin multilayer
cavity structure continued to outperform the conventional RFID tags of
similar outlines.
LTCC material offers excellent high-frequency properties and high
flexural strength
These RFID packages are an excellent example
of Kyocera’s extensive multilayer ceramic capability, using a
proprietary Low Temperature Co-fired Ceramic (LTCC) formulation and a
copper conductor metallization system. The packages take advantage of
the low-loss and high-frequency benefits of LTCC, yet deliver the high
flexural strength expected from High Temperature Co-fired Ceramic (HTCC).
Cavity structure for IC chip protection and ultra-small tag design
With
a cavity designed specifically for an IC chip, this package offers
excellent protection against mechanical stress and impact, while
facilitating ultra-small, low-profile tag design.
Suitable for metallic products
In contrast to traditional
tags that tend to block RF signals, Kyocera’s ceramic package is
designed to maximize read range in proximity to metal. This expands RFID
feasibility in applications involving metallic products or objects,
opening new potential uses in automotive, factory automation, healthcare
and many other fields.
Wide range of products
Kyocera offers many options to meet
diverse customer requirements. The packages are available in six base
configurations — three different sizes for both the UHF and HF*4
(for ultra-short-distance communication) bands. To meet diverse customer
demands, Kyocera offers built-in IC chip arrangement and device
assembly, providing RFID tags as finished products, in addition to
providing ceramic packages and customized designs upon request.
*1 Radio Frequency Identification
*2 Based on research by Kyocera
*3
Systems complying with the UHF Gen2 standard for RFID use the 860 to 960
MHz band
*4 Most HF RFID systems operate at 13.56 MHz
For more info and images, please visit:
http://global.kyocera.com/news/2017/0502_hvos.html
Kyocera Corporation (NYSE:KYO)(TOKYO:6971) (http://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of electronic components, semiconductor packages, industrial ceramics, printers, copiers, solar power generating systems, mobile phones and cutting tools. During the year ended March 31, 2017, the company’s net sales totaled 1.42 trillion yen (approx. USD12.7 billion). Kyocera appears on the 2014 and 2015 listings of the “Top 100 Global Innovators” by Thomson Reuters, and is ranked #531 on Forbes magazine’s 2016 “Global 2000” listing of the world’s largest publicly traded companies.
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