ACM Research Announces Grand Opening of New Factory in Shanghai

FREMONT, Calif., Sept. 28, 2018 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM Research” or the “Company”) (NASDAQ:ACMR), a provider of single-wafer wet cleaning equipment used by manufacturers of advanced semiconductors, today announced the grand opening of its new factory in Shanghai, China.  The Company held an opening ceremony on September 28 to mark the completion of its new production facility.  The new facility is located in the Pudong region of Shanghai, which is approximately 20 kilometers from the Company's Shanghai headquarters.  Local government officials and politicians attended the opening ceremony together with customers, suppliers and the ACM management team.

ACM Research’s President and Chief Executive Officer Dr. David Wang commented, “We are excited to celebrate this milestone with our community.  Our partnership with the Shanghai Pudong region has been a significant driving force behind our capacity expansion project.  Our employees and partners have worked hard to start up this facility, and we are very excited to expand our manufacturing presence in the Shanghai area, which will greatly maximize our operational efficiency at our current scale.  We continue to believe that our proximity to large customers in China as well as the rest of Asia gives us a competitive advantage in anticipating the latest technical and manufacturing requirements at some of the most advanced fabs in the world.”

The new factory has a total of 50,000 square feet of available floor space.  This represents capacity to support an incremental $250 million of annual production when fully-loaded.  In addition to the Company’s original factory in the Zhangjiang High Tech Park, ACM Research now has a combined total of 86,000 square feet of floor space, which could support more than $350 million of annual production capacity.  

About ACM Research, Inc.

ACM Research develops, manufactures and sells single-wafer wet cleaning equipment, which semiconductor manufacturers can use in numerous manufacturing steps to remove particles, contaminants and other random defects, and thereby improve product yield, in fabricating advanced integrated circuits.

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