• Nano-printing technology developed by Polish XTPL is a response to the production challenges faced by leading players from several areas of the advanced electronics market;
• XTPL in recent months has signed cooperation agreements with the Chinese BOE - market leader in display production, Korean HPK - a leading supplier of defect repair solutions for LG and with OSRAM - a German group operating in the lighting industry;
• Signed documents start the evaluation of XTPL technology by partners or initiate the stage of adjusting the technology to the specific requirements of the client's production process;
• Agreements precede business negotiations regarding the terms of future commercial contracts to be based on licensing the technology of the Polish company.

XTPL S.A. develops and commercializes the unique technology of ultra-precise printing of nanomaterials for use in the area of advanced electronics. The company's method allows for extremely accurate application of specially composed nano-ink on various substrates and creation of structures at the scale of single micrometers. The XTPL solution responds to the market demand of progressive miniaturization and benefits from the advantages of traditional printing, such as scalability, cost effectiveness, simplicity and speed. Equally important, this technology does not require the use of an electric field, and thus eliminates the risk of damage to the substrate and other electrically active components.

"Thanks to the unique combination of these four features, XTPL nano-printing technology offers manufacturers significant competitive advantages. Recent months confirm this. We sign further agreements with strong partners who contact us on their own initiative. It makes us happy and motivates us to work even harder. Together with our partners, we want to develop the XTPL method further to solve technological challenges not only for current but also future generations of products" says Dr. Filip Granek, CEO of XTPL.

In November 2019, XTPL signed a memorandum of understanding (MoU) with the Korean HPK - one of the main suppliers of defect repair solutions for LG Display. The document opens the way to start negotiations aimed at implementing nanoprinting technology in partner's devices dedicated for display production. During this period, the Polish company also concluded a contract for the evaluation of its solution with the global display giant, the Chinese company BOE (the entity in 2018 generated USD 13.9 billion in revenues). The aim of the project is to improve electrical conductivity for the latest generation of OLED and QLED displays. In addition, in January this year, XTPL signed an agreement with one of the largest lighting equipment manufacturers in the world - the OSRAM concern (with annual revenues of over EUR 3.5 billion). It initiates the evaluation of the company's technology for use in creating conductive connections for semiconductors present in lighting devices.

"The commercialization process in deep tech companies, such as XTPL, consists each time of at least several stages, and each of them lasts from several to over a dozen months. Cooperation agreements signed in recent months signal the entry into the next advanced levels of this process with selected partners. The proof of concept stage, currently implemented with BOE and OSRAM, assumes the validation of the technology and confirmation of its parameters in accordance with customer requirements. The success of this phase will initiate talks regarding the shape of the future commercial contract. On the other hand signing the MoU with the Korean HPK means launching the so-called "design in" stage, whose goal is already to adapt the technology to the specific requirements of the partner's processes and to start negotiating business conditions of future cooperation" explains Dr. Filip Granek. XTPL is the world's most precise printing technology applicable in the rapidly growing electronics market. The XTPL method is unique because of a combination of several features: it is an additive method, which ensures significant time and material savings and allows the advantages of printing - such as scalability, cost effectiveness, simplicity and speed - to be used in the production of advanced devices thanks to unprecedented precision (feature size < 3 micrometers) and without a need to use electric field. At present, the company is focusing on commercialization of its technology in two application fields. The first one is displays - here XTPL first intends to offer the "open defect repair" technology for repairing conductive structures whose defects are responsible for dead pixels occurring in high resolution matrices already at the production stage. Next, the company plans to provide this industry with solutions that will help achieve a significant increase in the resolution of a new class of displays, allowing the manufacture of displays on flexible substrates. The second potential application field for XTPL is the market of smart glass. In the longer perspective, XTPL intends to develop its platform solution for subsequent market segments. The company's technology may be implemented in the semiconductor industry as a sought-after alternative for photolithography and, for example, facilitate the fabrication of innovative anti-counterfeiting solutions, advanced PCBs, functional and effective biosensors and high-performance photovoltaic panels. Technological progress, in which XTPL is to play an important role, consists in enabling the production of complex and complicated electronic devices using cost-effective and scalable printing methods. To find out more, please visit . Additional information is available from:
 

Marta Jankiewicz | marketing & PR director at XTPL S.A.

+ 48 664 423 948 |