TDY Teledyne Technologies Incorporated

Teledyne to Host Payloads on the International Space Station

Teledyne Technologies Incorporated (NYSE:TDY) today announced that Teledyne Brown Engineering’s Multi-User System for Earth Sensing (MUSES) was launched to the International Space Station (ISS) on a SpaceX Falcon 9 rocket from Launch Complex 39A at NASA’s Kennedy Space Center on June 3, 2017. Over the last week, MUSES was installed on the ISS and completed a successful initial operational assessment.

MUSES was developed as part of a cooperative agreement with NASA and will provide opportunities for imaging, technology demonstration, and space qualification payloads supporting research, scientific studies, and humanitarian efforts for both government and commercial customers. MUSES provides a precision-pointing environment for earth-viewing instruments, such as high-resolution digital cameras and hyperspectral imagers. It can accommodate up to four payloads simultaneously and offers the ability to robotically change, upgrade, and service those instruments.

Orbiting approximately 250 miles above the Earth, the MUSES platform will offer researchers a unique vantage point for Earth observation, disaster response, maritime domain awareness, agricultural applications, air and water quality, oil and gas exploration, mining, atmospheric investigations, and fire detection.

“The MUSES platform installation is a tremendous step toward the commercialization of the International Space Station. The ability to return payloads and reuse canisters creates a low-cost path to space for professional-grade payloads,” said Robert Mehrabian, Chairman, President and Chief Executive Officer. “We are proud to be a part of this mission and look forward to many more in the future.”

The MUSES platform is ideal for both long-term operational instruments, and short-duration technology demonstrations including space hardware qualification. The unique ability to return payloads to earth allows for post-mission analysis and preservation of investment through reuse of instruments and payload canisters.

An on-board server located inside the ISS has the ability to buffer, store, and transmit data from MUSES’ four payloads back to Earth at Teledyne’s Payload Operation Center in Huntsville, Alabama. The server has the bandwidth to support four MUSES payloads as well as the interconnectivity and data resources to support other experiments aboard the ISS.

About Teledyne Brown Engineering

Teledyne Brown Engineering is an industry leader in full-spectrum engineering and advanced manufacturing solutions for harsh environments for the space, defense, energy, and marine industries. For over six decades the company has successfully delivered innovative systems, integration, operations, and technology development worldwide. For more information about Teledyne Brown Engineering visit: www.tbe.com.

About Teledyne Technologies Incorporated

Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems. Teledyne Technologies’ operations are primarily located in the United States, the United Kingdom, Canada, and Western and Northern Europe. For more information, visit Teledyne Technologies’ website at www.teledyne.com.

Forward-Looking Information Cautionary Notice

This press release contains forward-looking statements, as defined in the Private Securities Litigation Reform Act of 1995. Actual results could differ materially from these forward-looking statements. Many factors could change anticipated results, including funding, continuation and award of government programs, as well as risks associated with government contracts, are identified in Teledyne’s 2016 Annual Report on Form 10-K.

EN
12/06/2017

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on Teledyne Technologies Incorporated

 PRESS RELEASE

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表 米国ペンシルベニア州モンゴメリービル, Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Technologies [NYSE: TDY]の企業であり、高度なイメージングソリューションのグローバルリーダーであるTeledyne Judson Technologiesは、要求の厳しいアプリケーション向けの高性能、大容量カメラの発売を発表しました。SCIONプラットフォームは、10ミクロンのピクセルピッチと640 x 512および1280 x 1024のフォーマットを備えた新しいクラスのSWIRイメージングソリューションを導入し、Teledyneの数十年にわたる高感度 センサーの専門知識と、ハイパースペクトルイメージング、バイオサイエンス、宇宙&防衛、半導体市場で必要とされる速度、俊敏性、コスト効率を組み合わせています。 サイオンカメラは、材料分析、蛍光測定、欠陥検出、地球観測など、幅広い用途に対応しています。初期センサオプションは、Teledyne独自のVisGaAs (可視感受性InGaAs )およびMCT (水銀テルル化カドミウム)センサ材料を活用して、300〜1700 nmまたは900〜2500 nmの感度を実現します。これらのカメラは、広い感度と高いフレー...

 PRESS RELEASE

Teledyne Introduces the SCION Family of VIS–SWIR Cameras

Teledyne Introduces the SCION Family of VIS–SWIR Cameras MONTGOMERYVILLE, Pa., Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Judson Technologies, a Teledyne Technologies [NYSE: TDY] company and global leader of advanced imaging solutions, announces the launch of the —a new line of high-performance, high-volume cameras for demanding applications. The SCION platform introduces a new class of SWIR imaging solutions with a 10-micron pixel pitch and formats of 640x512 and 1280x1024, combining Teledyne’s decades of high-sensitivity sensor expertise with the speed, agility and cost-efficiency requi...

Moody's Ratings upgrades Teledyne senior unsecured rating to Baa1; out...

Moody's Ratings (Moody's) upgraded the senior unsecured ratings of Teledyne Technologies Incorporated ("Teledyne") to Baa1 from Baa2. The rating outlook has been changed to stable from positive. "The ratings upgrade reflects Teledyne's strong business profile underpinned by a leading portfolio of ...

 PRESS RELEASE

Teledyne kündigt die Xtium3 PCIe Gen4-Framegrabber-Serie für ultraschn...

Teledyne kündigt die Xtium3 PCIe Gen4-Framegrabber-Serie für ultraschnelle Bildaufnahme an MONTREAL, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Teledyne DALSA, ein Unternehmen von Teledyne Technologies [NYSE: TDY], stellt die  PCIe Gen4-Familie vor. Diese Framegrabber der nächsten Generation wurden für maximalen Dauer-Durchsatz und sofort einsatzbereite Bilddaten in anspruchsvollen industriellen Anwendungen entwickelt. Auf Basis der bewährten -Plattform unterstützt das erste neue Modell Xtium3-CLHS PX8 den Camera Link HS® (CLHS)-Standard über die PCI Express™ Gen 4.0-Schnittstelle. Diese Single-S...

 PRESS RELEASE

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fas...

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fast image acquisition MONTREAL, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company, announces the release of the  PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications. Building on the proven platform, the first model, Xtium3-CLHS PX8 supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution a...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch