ELG Elmos Semiconductor SE

DGAP-News: Elmos Semiconductor AG and Samsung Electronics launch foundry cooperation on automotive process technology

DGAP-News: Elmos Semiconductor AG / Key word(s): Alliance
Elmos Semiconductor AG and Samsung Electronics launch foundry cooperation on automotive process technology

04.03.2020 / 13:17
The issuer is solely responsible for the content of this announcement.


Elmos Semiconductor AG (FSE: ELG) has signed a cooperation agreement with Samsung Electronics. The agreement covers the manufacturing of ICs on wafer level for automotive applications in Samsung's state-of-the-art facilities. Through this agreement, Samsung Electronics gains a renowned partner to pursue their strategic priority to develop their foundry automotive capabilities further and Elmos a prominent partner to further strengthen its Fablite manufacturing strategy and to get access to a wide range of advanced process technologies.

"The cooperation with Samsung Electronics is an important step in our Fablite manufacturing strategy. Samsung's advanced automotive qualified 130nm BCD platform including an embedded flash solution is an outstanding process technology that opens up new opportunities for our semiconductor development," says Dr. Jan Dienstuhl, CSO of Elmos.

"Europe is worldwide highly regarded for products with an outstanding quality level especially in the automotive semiconductor field. To win one of the leading companies here in Europe is an honor and a challenge at the same time," says Shawn Han, Senior Vice President of Foundry Marketing Team at Samsung Electronics.

About Elmos Semiconductor AG
Elmos develops, produces and markets semiconductors and sensors, primarily for use in the automotive industry. Our components communicate, measure, regulate and control safety, comfort, powertrain and network functions. For over 30 years, Elmos innovations have been bringing new functions to life and making mobility worldwide safer, more comfortable and more energy efficient.

Contact
Elmos Semiconductor AG
Janina Rosenbaum, Head of Investor Relations, Fon: ?287
Mathias Kukla, Press Relations, Fon: ?199
Email:


04.03.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.

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