Apic Yamada is mainly engaged in the manufacture and sale of semiconductor assembly equipment and electronic components. Assembly Equipment segment is engaged in the manufacture and sale of auto molding equipment, package singulation systems, mounting systems, test handlers and transport systems, trimming and forming systems and precision die sets. Electronic Components segment is engaged in the manufacture and sale of lead frames, LED pre-molded substrates and other electronic components. Co. is also engaged in the manufacture and sale of lead frame processing dies and lead frame dies.
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