EUR 107.18 For Business Accounts Only

STATS ChipPAC Pte Ltd - Strategic SWOT Analysis Review

STATS ChipPAC Pte Ltd - Strategic SWOT Analysis Review provides a comprehensive insight into the company’s history, corporate strategy, business structure and operations. The report contains a detailed SWOT analysis, information on the company’s key employees, key competitors and major products and services.

This up-to-the-minute company report will help you to formulate strategies to drive your business by enabling you to understand your partners, customers and competitors better.

Scope

- Business description – A detailed description of the company’s operations and business divisions.
- Corporate strategy – GlobalData’s summarization of the company’s business strategy.
- SWOT analysis – A detailed analysis of the company’s strengths, weakness, opportunities and threats.
- Company history – Progression of key events associated with the company.
- Major products and services – A list of major products, services and brands of the company.
- Key competitors – A list of key competitors to the company.
- Key employees – A list of the key executives of the company.
- Executive biographies – A brief summary of the executives’ employment history.
- Key operational heads – A list of personnel heading key departments/functions.
- Important locations and subsidiaries – A list of key locations and subsidiaries of the company, including contact details.

Highlights

STATS ChipPAC Pte Ltd (STATS ChipPAC), a subsidiary of Jiangsu Changjiang Electronics Technology Co., Ltd, is a provider of fully integrated, multi-site, and end-to-end semiconductor packaging and testing solutions. The company provides semiconductor solutions through a broad technology portfolio, which ranges from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, system-in-package, to through Silicon Via (TSV) and 2.5D/3D packaging. STATS ChipPAC’s packaging solutions include embedded wafer level ball grid array, encapsulated wafer level chip scale packaging, fcCuBE technology, and FlexLine wafer level manufacturing method. It markets services through its direct sales force and serves customers in the communication, consumer and computing sectors across North America, Asia, and Europe. STATS ChipPAC is headquartered in Ang Mo Kio, Singapore.

Reasons to Buy

- Gain key insights into the company for academic or business research purposes. Key elements such as SWOT analysis and corporate strategy are incorporated in the profile to assist your academic or business research needs.
- Identify potential customers and suppliers with this report’s analysis of the company’s business structure, operations, major products and services and business strategy.
- Understand and respond to your competitors’ business structure and strategies with GlobalData’s detailed SWOT analysis. In this, the company’s core strengths, weaknesses, opportunities and threats are analyzed, providing you with an up to date objective view of the company.
- Examine potential investment and acquisition targets with this report’s detailed insight into the company’s strategic, business and operational performance.

Note: Some sections may be missing if data is unavailable for the company.