01 Communique to present at the Q1 Virtual Investor Summit
TORONTO, March 11, 2021 (GLOBE NEWSWIRE) -- via InvestorWire – 01 Communique (TSX-V: ONE; OTCQB: OONEF) today announced that Andrew Cheung, President and CEO, will be presenting at the Q1 Virtual Investor Summit and invites you to join him as he talks about the exciting opportunity in front of the Company. Quantum Computers have the ability to disrupt the world's cybersecurity. IronCAP™, the Company's new product offering, will be presented and shown how it allows businesses to easily transform their systems to withstand threats from Quantum Computers.
| Event | Q1 Investor Summit |
| Date | March 23-25, 2021 |
| Presentation | March 23 @3:00PM ET |
| Location |
About The Investor Summit
The Investor Summit (formerly MicroCap Conference) is an exclusive, independent conference dedicated to connecting smallcap and microcap companies with qualified investors. The Q1 Investor Summit will take place virtually, featuring 100 companies and over 300 institutional and retail investors.
To request complimentary investor registration: please visit our website at
Contact:
Brittney Blocker at
ABOUT 01 Communique
Established in 1992, 01 Communique (TSX-V: ONE; OTCQB: OONEF) has always been at the forefront of technology. The Company’s cyber security business unit focuses on post-quantum cybersecurity with the development of its IronCAP™ technology. IronCAP™’s patent-pending cryptographic system is an advanced Goppa code-based post-quantum cryptographic technology that can be implemented on classical computer systems as we know them today while at the same time can also safeguard against attacks in the future post-quantum world of computing. The Company’s remote access business unit provides its customers with a suite of secure remote access services and products under its I’m InTouch and I’m OnCall product offerings. The remote access offerings are protected in the U.S.A. by its patents #6,928,479 / #6,938,076 / #8,234,701; in Canada by its patents #2,309,398 /#2,524,039 and in Japan by its patent #4,875,094. For more information, visit the Company’s web site at and .
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