FormFactor Introduces Edge Coupling Probe Solution for Silicon Photonics Devices

LIVERMORE, Calif., March 10, 2020 (GLOBE NEWSWIRE) -- FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, today announced revolutionary new features to enhance its industry-leading . The new features extend the probing system’s capability to couple fibers to the edge of SiPh devices, both on singulated die and on wafers, enabling test engineers to measure device performance consistent with native operating conditions. In addition, FormFactor’s new machine vision techniques and in-situ calibration, and seamless integration of , help customers accelerate products to market.

enables rapid transfer of enormous amounts of data using optical signals instead of electrical signals. It continues to gain momentum, primarily driven by the data center and automotive applications, and is expected to grow at a CAGR of 19.7% between 2019 and 2027, according to .

This powerful measurement capability expands FormFactor’s long-standing MeasureOne partnership with Keysight for photonics applications. The new edge-coupling features provide engineers flexibility to perform measurements optimized for their device designs. New features of the system include:

• Die and wafer-level edge coupling for photonic devices provides measurement capability that closely simulates device operation
• Advanced, in-situ optical positioner calibration with FormFactor’s OptoVue™ and OptoVue™ Pro for faster time to accurate measurement results
• Thermal range capability from -40 to 125C in an enclosed environment
• In-situ power measurements of single fibers and fiber arrays to examine insertion path loss
• Integration of FormFactor probe station control and wafer-level measurement in Keysight’s Wafer Prober TAP Plug-In software provides test steps that can be added to work-flow sequences without instrument-level programming commands
• Scalable platform with photonic instruments, up to 110GHz, and shorten the test time of opto-electrical characterization

“Revolutionary advances in our silicon photonics test and measurement capability further demonstrate our commitment to this important technology development and to deliver solutions that enable engineers to deliver faster results,” said Claus Dietrich, Vice President and General Manager of FormFactor’s System Business Unit. “The enhancements we see today are the result of working closely with our customers and Keysight to enable the capabilities that are breaking new ground in ultra-fast data transmission.”

“The advancement of integrated photonic circuit technology is needed to meet future power and cost targets for massive data center build-outs. I’m very excited to see our joint R&D forces having realized end-to-end automated test capabilities including the new N7700210C Wafer Prober TAP plug-In software. This software combines scalable test and measurement tools with probe mechanics under Keysight’s , which is the only software tool providing full control of work-flow sequences,” said Dr. Joachim Peerlings, Vice President and General Manager of Keysight’s Network & Data Center Solutions.

About FormFactor

FormFactor, Inc. (NASDAQ:FORM), is a leading provider of essential test and measurement technologies along the full IC life cycle – from inspection and metrology, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The Company serves customers through its network of facilities in Asia, Europe, and North America. For more information, visit the Company’s website at

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This press release contains forward-looking statements within the meaning of the “safe harbor” provisions of the federal securities laws, including with respect to the Company’s future financial and operating results, the Company’s plans, strategies and objectives for future operations. These statements are based on management’s current expectations and beliefs as of the date hereof, and are subject to a number of risks and uncertainties, many of which are beyond the Company’s control, that could cause actual results to differ materially from those described in the forward-looking statements. These forward-looking statements include, but are not limited to statements regarding future financial and operating results, customer demand, conditions in the semiconductor industry, and growth opportunities, and other statements regarding the Company’s business. Forward-looking statements may contain words such as “may,” “might,” “will,” “expect,” “plan,” “anticipate,” and “continue,” the negative or plural of these words and similar expressions, and include the assumptions that underlie such statements. The following factors, among others, could cause actual results to differ materially from those described in the forward-looking statements: changes in demand for the Company’s products; customer-specific demand; the speed of customer implementation of new technologies; industry seasonality; risks to the Company’s ability to realize operational efficiencies; changes macro-economic environments; events affecting global and regional economic stability such as Brexit, epidemics, military conflicts, political volatility and similar factors, operating separately or in combination; and other factors, including those set forth in the Company’s most current annual report on Form 10-K, quarterly reports on Form 10-Q and other filings by the Company with the U.S. Securities and Exchange Commission. No assurances can be given that any of the events anticipated by the forward-looking statements will transpire or occur, or if any of them do so, what impact they will have on the results of operations or financial condition of the Company. Unless required by law, the Company is under no obligation (and expressly disclaims any such obligation) to update or revise its forward-looking statements whether as a result of new information, future events, or otherwise.

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