TDY Teledyne Technologies Incorporated

Teledyne e2v releases Hydra3D+, the first high resolution ToF sensor to work in all light conditions without motion artefacts

Teledyne e2v releases Hydra3D+, the first high resolution ToF sensor to work in all light conditions without motion artefacts

GRENOBLE, France, Jan. 10, 2023 (GLOBE NEWSWIRE) -- Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY] announces the release of its , a new Time-of-Flight (ToF) CMOS image sensor which incorporates 832 x 600 pixel resolution and is tailored for versatile 3D detection and measurement.

Designed with Teledyne e2v’s proprietary CMOS technology, Hydra3D+ features a brand-new 10 µm three-tap pixel which provides very fast transfer times (starting from 10ns), and displays high sensitivity in the NIR wavelength, alongside excellent demodulation contrast. This precise combination enables the sensor to operate in real-time without motion artefacts (even if there are fast moving objects in the scene) and with excellent temporal noise at short ranges, essential in applications such as pick and place, logistics, factory automation and factory safety. An innovative on-chip multi-system management feature enables the sensor to work alongside multiple active systems without interference which can lead to false measurements.

The excellent sensitivity of Hydra3D+ enables it to effectively manage lighting power and handle a wide range of reflectivity. Its high resolution, with powerful on-chip HDR, featuring an on-the-fly flexible configuration, enables the best trade-off between application-level parameters, such as distance range, object reflectivity, frame rate etc. This makes it ideal for mid, long-range distances and/or outdoor applications such as automated guided vehicles, surveillance, ITS and building construction.

The sensor has been thoughtfully designed for customers seeking real-time and flexible 3D detection with uncompromised 3D performance. It offers large field-of-view scenes captured in both 2D and 3D by a compact sensor which makes the system very cost effective.

Ha Lan Do Thu, Marketing Manager for 3D imaging at Teledyne e2v said, “Today, many Time-of-Flight sensors suffer from motion artefacts and can’t instantly perform in changing operating conditions. With Hydra3D+, our customers can easily achieve reliable 3D measurement with the highest levels of 3D performance, uncompromised image quality in both 2D and 3D modes, and in all distance ranges and conditions even where multiple systems operate or in outdoor environments.”

Documentation, samples, and development tools are now available upon request. In addition, there are several proprietary modelling tools to support customers in their assessment of the operation of Hydra3D+.

About Teledyne e2v

Teledyne e2v innovations lead developments in healthcare, life sciences, space, transportation, defense and security and industrial markets. Teledyne e2v’s unique approach involves listening to the market and application challenges of their customers and partnering with them to provide innovative standard, semi-custom or fully custom imaging solutions, bringing increased value to their systems.

For more information, visit imaging.teledyne-e2v.com

Teledyne e2v media enquiries contact:

A photo accompanying this announcement is available at



EN
10/01/2023

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on Teledyne Technologies Incorporated

Teledyne Technologies Inc: 1 director

A director at Teledyne Technologies Inc sold 4,000 shares at 621.000USD and the significance rating of the trade was 69/100. Is that information sufficient for you to make an investment decision? This report gives details of those trades and adds context and analysis to them such that you can judge whether these trading decisions are ones worth following. Included in the report is a detailed share price chart which plots discretionary trades by all the company's directors over the last two yea...

 PRESS RELEASE

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表 米国ペンシルベニア州モンゴメリービル, Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Technologies [NYSE: TDY]の企業であり、高度なイメージングソリューションのグローバルリーダーであるTeledyne Judson Technologiesは、要求の厳しいアプリケーション向けの高性能、大容量カメラの発売を発表しました。SCIONプラットフォームは、10ミクロンのピクセルピッチと640 x 512および1280 x 1024のフォーマットを備えた新しいクラスのSWIRイメージングソリューションを導入し、Teledyneの数十年にわたる高感度 センサーの専門知識と、ハイパースペクトルイメージング、バイオサイエンス、宇宙&防衛、半導体市場で必要とされる速度、俊敏性、コスト効率を組み合わせています。 サイオンカメラは、材料分析、蛍光測定、欠陥検出、地球観測など、幅広い用途に対応しています。初期センサオプションは、Teledyne独自のVisGaAs (可視感受性InGaAs )およびMCT (水銀テルル化カドミウム)センサ材料を活用して、300〜1700 nmまたは900〜2500 nmの感度を実現します。これらのカメラは、広い感度と高いフレー...

 PRESS RELEASE

Teledyne Introduces the SCION Family of VIS–SWIR Cameras

Teledyne Introduces the SCION Family of VIS–SWIR Cameras MONTGOMERYVILLE, Pa., Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Judson Technologies, a Teledyne Technologies [NYSE: TDY] company and global leader of advanced imaging solutions, announces the launch of the —a new line of high-performance, high-volume cameras for demanding applications. The SCION platform introduces a new class of SWIR imaging solutions with a 10-micron pixel pitch and formats of 640x512 and 1280x1024, combining Teledyne’s decades of high-sensitivity sensor expertise with the speed, agility and cost-efficiency requi...

Moody's Ratings upgrades Teledyne senior unsecured rating to Baa1; out...

Moody's Ratings (Moody's) upgraded the senior unsecured ratings of Teledyne Technologies Incorporated ("Teledyne") to Baa1 from Baa2. The rating outlook has been changed to stable from positive. "The ratings upgrade reflects Teledyne's strong business profile underpinned by a leading portfolio of ...

 PRESS RELEASE

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fas...

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fast image acquisition MONTREAL, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company, announces the release of the  PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications. Building on the proven platform, the first model, Xtium3-CLHS PX8 supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution a...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch