TDY Teledyne Technologies Incorporated

Teledyne’s backside illuminated TDI camera delivers greater sensitivity for near ultraviolet and visible imaging

Teledyne’s backside illuminated TDI camera delivers greater sensitivity for near ultraviolet and visible imaging

WATERLOO, Ontario, June 06, 2023 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is pleased to announce its Backside Illuminated (BSI) TDI camera is in production now. With its CLHS interface, this camera offers enhanced sensitivity and is ideal for Near Ultraviolet (NUV) and visible imaging applications such as wafer, flat panel display and electronic packaging inspection as well as photoluminescence and life science imaging.

The new Linea HS 16k BSI uses Teledyne DALSA’s charge-domain CMOS TDI 16k sensor with a 5x5 μm pixel size and delivers a maximum line rate of 400 kHz aggregate. Compared with Front Side Illumination (FSI), the BSI model significantly improves quantum efficiency in the near ultraviolet and visible wavelengths and boosts signal-to-noise ratio for imaging applications in light starved conditions.

Linea HS is the industry’s leading TDI product family for high-speed and high-sensitivity imaging. It provides cutting edge performance based on multi-array charge-domain CMOS TDI technology, offering advanced capabilities including mono/HDR, color, multifield, and super resolution imaging for demanding machine vision applications. Linea HS 16k BSI also has the same form factor as the FSI, so existing systems can be easily upgraded.

The Linea HS 16k BSI camera uses a CLHS data interface that delivers 6.5GPix/sec data throughput in a single cable. An active optical cable (AOC) enables a longer cable length which eliminates the need for a repeater, significantly improving data reliability and reducing system costs.

Please visit the for more information and for sales enquiries, visit our .

Teledyne DALSA is a part of Teledyne’s Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are at the heart of thousands of inspection systems around the world and across multiple industries. For more information, visit /imaging.

All trademarks are registered by their respective companies.

Teledyne DALSA reserves the right to make changes at any time without notice.

Media Contact: 

Jessica Broom

A photo accompanying this announcement is available at



EN
06/06/2023

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on Teledyne Technologies Incorporated

Teledyne Technologies Inc: 1 director

A director at Teledyne Technologies Inc sold 4,000 shares at 621.000USD and the significance rating of the trade was 69/100. Is that information sufficient for you to make an investment decision? This report gives details of those trades and adds context and analysis to them such that you can judge whether these trading decisions are ones worth following. Included in the report is a detailed share price chart which plots discretionary trades by all the company's directors over the last two yea...

 PRESS RELEASE

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表 米国ペンシルベニア州モンゴメリービル, Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Technologies [NYSE: TDY]の企業であり、高度なイメージングソリューションのグローバルリーダーであるTeledyne Judson Technologiesは、要求の厳しいアプリケーション向けの高性能、大容量カメラの発売を発表しました。SCIONプラットフォームは、10ミクロンのピクセルピッチと640 x 512および1280 x 1024のフォーマットを備えた新しいクラスのSWIRイメージングソリューションを導入し、Teledyneの数十年にわたる高感度 センサーの専門知識と、ハイパースペクトルイメージング、バイオサイエンス、宇宙&防衛、半導体市場で必要とされる速度、俊敏性、コスト効率を組み合わせています。 サイオンカメラは、材料分析、蛍光測定、欠陥検出、地球観測など、幅広い用途に対応しています。初期センサオプションは、Teledyne独自のVisGaAs (可視感受性InGaAs )およびMCT (水銀テルル化カドミウム)センサ材料を活用して、300〜1700 nmまたは900〜2500 nmの感度を実現します。これらのカメラは、広い感度と高いフレー...

 PRESS RELEASE

Teledyne Introduces the SCION Family of VIS–SWIR Cameras

Teledyne Introduces the SCION Family of VIS–SWIR Cameras MONTGOMERYVILLE, Pa., Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Judson Technologies, a Teledyne Technologies [NYSE: TDY] company and global leader of advanced imaging solutions, announces the launch of the —a new line of high-performance, high-volume cameras for demanding applications. The SCION platform introduces a new class of SWIR imaging solutions with a 10-micron pixel pitch and formats of 640x512 and 1280x1024, combining Teledyne’s decades of high-sensitivity sensor expertise with the speed, agility and cost-efficiency requi...

Moody's Ratings upgrades Teledyne senior unsecured rating to Baa1; out...

Moody's Ratings (Moody's) upgraded the senior unsecured ratings of Teledyne Technologies Incorporated ("Teledyne") to Baa1 from Baa2. The rating outlook has been changed to stable from positive. "The ratings upgrade reflects Teledyne's strong business profile underpinned by a leading portfolio of ...

 PRESS RELEASE

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fas...

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fast image acquisition MONTREAL, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company, announces the release of the  PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications. Building on the proven platform, the first model, Xtium3-CLHS PX8 supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution a...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch