TDY Teledyne Technologies Incorporated

New USB3 vision interface board level cameras engineered for embedded vision systems

New USB3 vision interface board level cameras engineered for embedded vision systems

Teledyne Lumenera expands its Lt Series USB3 camera portfolio leveraging the latest rolling shutter Starvis CMOS sensors and global shutter Pregius CMOS sensors from Sony

OTTAWA, April 21, 2020 (GLOBE NEWSWIRE) -- Teledyne Lumenera, a Teledyne Technologies [NYSE:TDY] company, and manufacturer and developer of digital cameras for industrial and scientific imaging applications, is pleased to announce the release of its new Board Level Cameras. Equipped with the latest rolling shutter Starvis™ CMOS sensors and global shutter Pregius™ CMOS sensors from Sony®, and ranging in resolution from 2 - 20 megapixels, these new board level cameras provide flexibility for a wide variety of imaging systems. Teledyne Lumenera’s Lt Series Board Level Cameras offer a smaller, lighter, and lower cost imaging solution and are designed specifically to meet the challenges of today’s embedded systems.

“The compact design of the new Lt Series Board Level cameras allows for easy integration into imaging systems with small form factors, making them ideal for portable or handheld devices, and compact OEM system designs,” said Ghislain Beaupré, General Manager at Teledyne Lumenera. 

The Teledyne Lumenera Lt Series Board Level Cameras help ease the vision system design process by eliminating extra camera weight and housing material, making it easier for system designers to integrate these cameras into existing product designs. In addition, a board level camera allows system designers more flexibility around lens options for their imaging application.

Teledyne Lumenera Lt Series Board Level Cameras are engineered to deliver high dynamic range, high speed, with low read noise for applications such as aerial imaging, portable/OEM devices, Intelligent Traffic Systems (ITS), life sciences, and industrial inspection solutions.

Key Features:

  • The first 13 new USB3 board level cameras will range in resolution from 2 - 12 MP with additional resolutions added later this year
  • High sensitivity (pixel sizes from 2 μm to 3.45 μm) with back illuminated sensors and fast frame rates
  • Side mounted USB connectors for ease of integration in compact OEM solutions
  • USB3 Vision compliant, with Windows and Linux SDKs
  • 3-year warranty

For more information about Teledyne Lumenera’s Lt Series USB3 Board Level Cameras visit the .

Teledyne Lumenera, part of the Teledyne Imaging Group, is headquartered in Ottawa, Canada, and is a leading developer and manufacturer of high-performance digital cameras and custom imaging solutions. Teledyne Lumenera imaging solutions provide a unique combination of speed, resolution, and sensitivity to meet the most demanding digital imaging requirements, and deployed worldwide in a wide range of industrial and scientific applications. For additional information about Teledyne Lumenera, please visit or call 613-736-4077. To receive Teledyne Lumenera news releases when they are issued, contact us at .

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella.  forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.

All trademarks are registered by their respective companies.

Teledyne Lumenera reserves the right to make changes at any time without notice.

Contact:

Brooks Riendeau, Vice President of Marketing

613-736-4077 ext. 120

A photo accompanying this announcement is available at

EN
21/04/2020

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on Teledyne Technologies Incorporated

Teledyne Technologies Inc: 1 director

A director at Teledyne Technologies Inc sold 4,000 shares at 621.000USD and the significance rating of the trade was 69/100. Is that information sufficient for you to make an investment decision? This report gives details of those trades and adds context and analysis to them such that you can judge whether these trading decisions are ones worth following. Included in the report is a detailed share price chart which plots discretionary trades by all the company's directors over the last two yea...

 PRESS RELEASE

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表

Teledyne、SCIONファミリーのVIS - SWIRカメラを発表 米国ペンシルベニア州モンゴメリービル, Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Technologies [NYSE: TDY]の企業であり、高度なイメージングソリューションのグローバルリーダーであるTeledyne Judson Technologiesは、要求の厳しいアプリケーション向けの高性能、大容量カメラの発売を発表しました。SCIONプラットフォームは、10ミクロンのピクセルピッチと640 x 512および1280 x 1024のフォーマットを備えた新しいクラスのSWIRイメージングソリューションを導入し、Teledyneの数十年にわたる高感度 センサーの専門知識と、ハイパースペクトルイメージング、バイオサイエンス、宇宙&防衛、半導体市場で必要とされる速度、俊敏性、コスト効率を組み合わせています。 サイオンカメラは、材料分析、蛍光測定、欠陥検出、地球観測など、幅広い用途に対応しています。初期センサオプションは、Teledyne独自のVisGaAs (可視感受性InGaAs )およびMCT (水銀テルル化カドミウム)センサ材料を活用して、300〜1700 nmまたは900〜2500 nmの感度を実現します。これらのカメラは、広い感度と高いフレー...

 PRESS RELEASE

Teledyne Introduces the SCION Family of VIS–SWIR Cameras

Teledyne Introduces the SCION Family of VIS–SWIR Cameras MONTGOMERYVILLE, Pa., Jan. 20, 2026 (GLOBE NEWSWIRE) -- Teledyne Judson Technologies, a Teledyne Technologies [NYSE: TDY] company and global leader of advanced imaging solutions, announces the launch of the —a new line of high-performance, high-volume cameras for demanding applications. The SCION platform introduces a new class of SWIR imaging solutions with a 10-micron pixel pitch and formats of 640x512 and 1280x1024, combining Teledyne’s decades of high-sensitivity sensor expertise with the speed, agility and cost-efficiency requi...

Moody's Ratings upgrades Teledyne senior unsecured rating to Baa1; out...

Moody's Ratings (Moody's) upgraded the senior unsecured ratings of Teledyne Technologies Incorporated ("Teledyne") to Baa1 from Baa2. The rating outlook has been changed to stable from positive. "The ratings upgrade reflects Teledyne's strong business profile underpinned by a leading portfolio of ...

 PRESS RELEASE

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fas...

Teledyne announces Xtium3 PCIe Gen4 frame grabber series for ultra-fast image acquisition MONTREAL, Dec. 02, 2025 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company, announces the release of the  PCIe Gen4 family, a next-generation frame grabber engineered to deliver maximum sustained throughput and ready-to-use image data for high-performance industrial applications. Building on the proven platform, the first model, Xtium3-CLHS PX8 supports the Camera Link HS® (CLHS) standard over the PCI Express™ Gen 4.0 interface. This single-slot, single-cable solution a...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch