reports
Rudolph Technologies Reports 2018 First Quarter Results
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of semiconductor process control systems, lithography equipment, as well as process control and yield management software for wafer fabs and advanced packaging facilities, today announced financial results for the 2018 first quarter. 2018 First Quarter Highlights First quarter revenue of $73.1 million, an increase of 22 percent sequentially and a 20 percent increase over the 2017 first quarter. ...
Rudolph Technologies Schedules 2018 First Quarter Financial Results Co...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE:RTEC) will release its 2018 first quarter financial results after the market closes on Wednesday, May 2, 2018. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the internet. Michael P. Plisinski, Chief Executive Officer, and Steven Roth, Chief Financial Officer, will host the call. The call will take place: May 2, 2018 at 4:30 p.m. (EDT) To participate in the call, please dial (800) 239-9838 (...
Rudolph Technologies Reports 2017 Fourth Quarter and Full Year Results
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of semiconductor process control systems, lithography equipment, as well as process control and yield management software for wafer fabs and advanced packaging facilities, today announced financial results for the 2017 fourth quarter. 2017 Fourth Quarter Highlights Fourth quarter revenue of $60.1 million, an increase of 11 percent over the 2016 fourth quarter. Orders exceed $100 mil...
Rudolph Technologies Expands Memory Customer Base with $21 Million in ...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received over $21 million (USD) in orders for process control solutions from two customers: a Korean-based manufacturer of advanced DRAM ranking in the top five of worldwide semiconductor companies and a rapidly expanding 3D NAND manufacturer in China. The orders, which are evenly split between the two customers, span Rudolph’s broad portfolio of total process control solutions comprising metrology, inspection, and software. ...
Rudolph Technologies to Participate in the 20th Annual Needham Growth ...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that Michael P. Plisinski, chief executive officer, and Steven R. Roth, chief financial officer, will be participating in the 20th Annual Needham Growth Conference to be held at the Lotte New York Palace Hotel in New York, NY from January 17-18, 2018. Rudolph’s management will be available to meet with...
Rudolph Technologies Schedules 2017 Fourth Quarter and Full Year Finan...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE:RTEC) will release its 2017 fourth quarter and full year financial results after the market closes on Thursday, February 1, 2018. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the internet. Michael P. Plisinski, Chief Executive Officer, and Steven Roth, Chief Financial Officer, will host the call. The call will take place: February 1, 2018 at 4:30 p.m. (EST) To participate in the cal...
Rudolph Technologies to Participate in the Sixth Annual NYC Investor S...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies (NYSE: RTEC), today announced that company management is scheduled to participate in the 6th Annual NYC Investor Summit 2017, being held December 6, 2017 at the Le Parker Méridien Hotel, New York, NY. The presentation material utilized during the conference will be made accessible on the investor page of Company’s website at www.rudolphtech.com. About the NYC Investor SummitThe NYC Investor Summit is hosted by executive management from participating companies ...
Rudolph Technologies Reports 2017 Third Quarter Results
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of semiconductor process control systems, lithography equipment, as well as process control and yield management software for wafer fabs and advanced packaging facilities, today announced financial results for the 2017 third quarter. 2017 Third Quarter Highlights Third quarter revenue of $66.9 million, an increase of 9 percent over the 2016 third quarter. Orders received from two of...
Rudolph Technologies Schedules 2017 Third Quarter Financial Results Co...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE:RTEC) will release its 2017 third quarter financial results after the market closes on Monday, October 30, 2017. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the internet. Michael P. Plisinski, Chief Executive Officer, and Steven Roth, Chief Financial Officer, will host the call. The call will take place: October 30, 2017 at 4:30 PM (EDT) To participate in the call, please dial (888) 401-4...
Rudolph Announces Multiple Customers' Acceptance of Its Firefly Inspec...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor manufacturers, are now qualified for production. The Firefly Inspection Systems provide high-resolution visual and non-visual inspection in a variety of advanced packaging processes, including fan-out wafer-level packaging, panel-level packaging and wafer-level chip-scale packaging. Rudolph expects over $5M in revenue in Q3 2017 fro...
Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwa...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to microbumps, and even large C4 bumps. With the Dragonfly system, the advanced packaging industry now has premier high-volume 2D inspection and 3D bump metrology on a single platform. The first Dragonfly system with Truebump...
Rudolph Technologies to Present at Third Quarter 2017 Investor Confere...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that Michael P. Plisinski, chief executive officer, and Steven R. Roth, chief financial officer, will be participating in several investor conferences during the Company’s third quarter. The presentation materials utilized during the respective conferences will be made accessible on the investor page o...
Rudolph Technologies Reports 2017 Second Quarter Results
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of semiconductor process control systems, lithography equipment, as well as process control and yield management software for wafer fabs and advanced packaging facilities, today announced financial results for the 2017 second quarter. 2017 Second Quarter Highlights Company recorded highest all-time quarterly revenue of $67.4 million, an increase of 11 percent over the 2017 first quarter. ...
Rudolph Expanding Its Presence in China for AMOLED Display Lithograph...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for a JetStep® G lithography system from a second customer in China for pilot line manufacturing of next-generation AMOLED (active-matrix organic light-emitting diode) displays. The use of AMOLED displays in smartphones and wearables is growing rapidly because of their superior performance and form factor. Given the wide variety and rapid proliferation of consumer devices, an R&D or pilot line faci...
Rudolph Concludes Patent Infringement Lawsuit Against Camtek
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that it has reached a comprehensive patent settlement with Camtek, Ltd. in the ongoing patent infringement lawsuits between the two companies. Under the terms of the settlement agreement, the parties will dismiss all current litigation matters and Camtek will pay to Rudolph a one-time payment of $13 mi...
Rudolph Technologies Schedules 2017 Second Quarter Financial Results ...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE:RTEC) will release its 2017 second quarter financial results after the market closes on Wednesday, August 2, 2017. In conjunction with this release, Rudolph will host a conference call, which will be broadcast live over the internet. Michael P. Plisinski, Chief Executive Officer, and Steven Roth, Chief Financial Officer will host the call. The call will take place: August 2, 2017 at 4:30 p.m. EDT To participate in the call, please dial (888) 394-82...
Rudolph Technologies to Participate in 9th Annual CEO Investor Summit ...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced that management will participate in the 9th Annual CEO Investor Summit, taking place Wednesday July 12, 2017 in San Francisco, CA. The CEO Summit is an accredited investor and publishing research analyst event held concurrently with SEMICON® West and Intersolar 2017 in San Francisco. The event is ho...
Rudolph JetStep S Lithography System Advances Panel-Based Advanced Pac...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel level processing. The system, which will ship in June 2017 to an outsourced assembly and test (OSAT) facility based in Asia, will be used to produce system-in-package (SiP) products that combine sensor, processor and memory functions for the automotive industry. “Inherently large in size with a rectangular form factor, a SiP is ideally suited f...
Rudolph Technologies to Present at Second Quarter 2017 Investor Confer...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that Michael P. Plisinski, chief executive officer, and Steven R. Roth, chief financial officer, will be participating in several investor conferences during the Company’s second quarter. The presentation materials utilized during the respective conferences will be made accessible on the investor page ...
Rudolph Technologies Reports 2017 First Quarter Results
WILMINGTON, Mass.--(BUSINESS WIRE)-- Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, today announced financial results for the 2017 first quarter. 2017 First Quarter Highlights First quarter revenue of $60.7 million increased 12 percent over the same period last year and was above the high-end of Company guidance. Revenue driven by 23 percent growth i...
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