AMAT Applied Materials Inc.

Applied Materials Announces a Strategic Investment in BE Semiconductor Industries

Applied Materials Announces a Strategic Investment in BE Semiconductor Industries

Purchased 9 percent of outstanding shares to build upon four years of successful collaboration on hybrid bonding technology for advanced packaging

SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry.

Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry’s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, which increases density and shortens the lengths of interconnect wiring between chiplets, resulting in improved overall performance, power consumption and cost.

“We view this as a strategic, long-term investment that demonstrates Applied Materials’ commitment to co-developing the industry’s most capable hybrid bonding solution, a technology that is becoming increasingly important to the advanced logic and memory chips at the foundation of AI,” said Terry Lee, Corporate Vice President and General Manager, Heterogeneous Integration and Packaging at Applied Materials. “We look forward to furthering our collaboration with Besi and delivering innovative technology to our customers.”

Applied Materials and Besi have co-developed an integrated hybrid bonding system, which has the full capabilities chipmakers need to take the technology to very high-volume manufacturing over the next several years. The system brings together Applied’s expertise in front-end wafer and chip processing with high levels of bonding accuracy and speed from Besi’s leading die placement, interconnect and assembly solutions.

The investment was made through market-based transactions and is not subject to regulatory approvals. Applied does not intend to seek board representation at Besi, nor does it have plans to purchase additional shares of Besi common stock.

About Applied Materials

Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future. Learn more at .

Applied Materials Contact:

(editorial/media) 408.235.4676

(financial community) 408.986.7977



EN
14/04/2025

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on Applied Materials Inc.

 PRESS RELEASE

Applied Materials Appoints Jim Anderson to Board of Directors

Applied Materials Appoints Jim Anderson to Board of Directors SANTA CLARA, Calif., July 22, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced the appointment of Jim Anderson to serve on its board of directors. Mr. Anderson brings over 25 years of experience in the technology sector and semiconductor ecosystem. Mr. Anderson has also been appointed to the board’s Strategy and Investment Committee. “We are excited to welcome Jim to our board,” said Tom Iannotti, Chairman of the Board. “Jim’s extensive experience in innovation-driven technology businesses will be invaluable ...

Pierre FerraguÊ
  • Pierre FerraguÊ

Semi cycle update. Much ado about nothing: Tariff and DeepSeek effects...

We publish today our quarterly and extensive review of where fundamentals, expectations, and valuations stand in semis and give our views on how investors should be positioned for the rest of the year. For details, please follow the link below.

Pierre FerraguÊ
  • Pierre FerraguÊ

Memory: China XPU ban lifted. Samsung most exposed. All benefit

Nvidia announced it can resume shipping XPUs to China. We’ve prepared a one-slider summarising the implications for memory vendors.

Pierre FerraguÊ
  • Pierre FerraguÊ

Deep dive into Chinese Semicap: How much of a headwind for Western pla...

Chinese WFE spending quadrupled in five years to $41bn, driven by aggressive local deployments, while domestic vendors rapidly gained traction, capturing 13% of local spending already, mostly in deposition, etch, and CMP. In this deep dive, we assess the competitiveness of key Chinese vendors, including Naura, AMEC, and SiCarrier. We estimate first the pace (and the scope) at (and on) which they could close the gap with their western peers. On that basis we estimate the share they can gain ov...

 PRESS RELEASE

Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in...

Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions To Enable More Energy-Efficient AI Data Centers SANTA CLARA, Calif. and GRENOBLE, France, June 16, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the organizations plan to expand their and develop materials engineering solutions to address emerging i...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch