SOI Soitec SA

Soitec contributes to accelerated development of integrated optical connectivity solutions for AI datacentres with its silicon photonics SOI technology  

Soitec contributes to accelerated development of integrated optical connectivity solutions for AI datacentres with its silicon photonics SOI technology  



Soitec contributes to accelerated development of integrated optical connectivity solutions for AI datacentres with its silicon photonics SOI technology

  • Industry development of co-packaged optics (CPO) accelerating towards commercialisation
  • CPO chip architectures directly integrate photonics for up to 30% energy saving
  • Soitec, a leader in SOI wafers for photonics, joins key industry alliance

Bernin (France), March 19, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, welcomes recent industry steps to accelerate development and commercialisation of co-packaged optics (CPO) solutions for datacentres.

The rapidly rising data requirements of AI and high-performance computing (HPC) are driving demand for silicon photonics-based CPO architectures, which integrate optical connectivity directly into processor housings or ‘packaging’, increasing both bandwidth and energy-efficiency.

Recent industry initiatives to accelerate the commercialization of co-packaged optics include the unveiling of NVIDIA's first CPO products, Spectrum-X and Quantum-X, on March 18, 2025. These innovations will be integrated into the next generation of NVIDIA servers designed for AI cloud infrastructure. These announcements follow the earlier introduction of groundbreaking CPO products and demonstrators by Broadcom, Intel, and Marvell.

Processor architectures are being overhauled as growing data demand pushes them to current limits and drives higher electricity consumption. For datacentres, CPO adoption enables energy savings of around 30% compared with current optical transceiver-based solutions.

Soitec is at the forefront of the transition from electrical to optical interconnects. CPO components are reliant on specialist silicon-on-insulator (Photonics-SOI) substrates, in which Soitec is a leader. With its two decades of experience in Photonics-SOI and industrial capacity to scale the technology, Soitec is uniquely placed to support market demand while maintaining high performance and reliability.

Pierre Barnabé, Soitec Chief Executive Officer, said:

The coming shift to CPO-based datacentre architectures is a major opportunity for Soitec’s advanced semiconductor materials, which already offer significant energy-efficiency and performance gains in applications ranging from mobile and wireless connectivity to electric cars. The latest industry initiatives and announcements show that momentum for widespread CPO adoption is building. This is further evidence that our strategic investments in innovation and technological diversification are paying off.”

Soitec today separately announces that it has joined the SEMI Silicon Photonics Industry Alliance (SEMI SiPhIA), a group of more than 100 semiconductor industry partners, with TSMC and ASE serving as the alliance's advocates. The alliance's mission is to drive silicon photonics innovation and applications, advance industry standards, and foster knowledge-sharing, resource integration, and technical exchange. Through its membership, Soitec will contribute to strengthening supply chain partnerships and fostering international collaboration on the deployment of key next-generation technologies, including CPO.

*****

About Soitec

Soitec (Euronext - Tech Leaders), a world leader in innovative semiconductor materials, has been developing cutting-edge products delivering both technological performance and energy efficiency for over 30 years. From its global headquarters in France, Soitec is expanding internationally with its unique solutions, and generated sales of 1 billion Euros in fiscal year 2023-2024. Soitec occupies a key position in the semiconductor value chain, serving three main strategic markets: Mobile Communications, Automotive and Industrial, and Edge and Cloud AI. The company relies on the talent and diversity of its 2,300 employees, representing 50 different nationalities, working at its sites in Europe, the United States and Asia. Soitec has registered over 4,000 patents.

Soitec, SmartSiC™ and Smart Cut™ are registered trademarks of Soitec.

For more information: /en/ and follow us on LinkedIn and X: @Soitec_Official

# # #

Investor Relations:

Media contact:



Attachment



EN
19/03/2025

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on Soitec SA

 PRESS RELEASE

Soitec confirme son excellence en innovation et progresse encore dans ...

Soitec confirme son excellence en innovation et progresse encore dans le classement INPI 2024 des déposants de brevets Soitec confirme son excellence en innovation et progresse encore dans le classement INPI 2024 des déposants de brevets Bernin (France), le 31 mars 2025 – Soitec (Euronext – Tech Leaders), un leader mondial de la conception et de la production de matériaux semi-conducteurs innovants, confirme une nouvelle fois son excellence en innovation avec une progression remarquable dans le classement 2024 des déposants de brevets en France, publié par l’INPI (Institut National de la...

 PRESS RELEASE

Soitec confirms its excellence in innovation with progress up 2024 INP...

Soitec confirms its excellence in innovation with progress up 2024 INPI patent ranking Soitec confirms its excellence in innovation with progress up 2024 INPI patent ranking Bernin (France), March 31, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, once again demonstrates its excellence in innovation through its rise in the 2024 ranking of patent filers published by the INPI (the French National Institute of Industrial Property). This recognition highlights Soitec’s unwavering commitment to innovation and confir...

Pierre FerraguÊ
  • Pierre FerraguÊ

The Tech Infrastructure Quarterly Bible 4Q24

We publish today our comprehensive quarterly bible: 240 pages of detailed analyses on what happened in the last 3 months, and how we interpret it, in light of our current convictions. The first section acts as a PM summary, outlining our key findings, and latest thoughts on the semi cycle, in 6 slides.

 PRESS RELEASE

Soitec contributes to accelerated development of integrated optical co...

Soitec contributes to accelerated development of integrated optical connectivity solutions for AI datacentres with its silicon photonics SOI technology   Soitec contributes to accelerated development of integrated optical connectivity solutions for AI datacentres with its silicon photonics SOI technology Industry development of co-packaged optics (CPO) accelerating towards commercialisationCPO chip architectures directly integrate photonics for up to 30% energy savingSoitec, a leader in SOI wafers for photonics, joins key industry alliance Bernin (France), March 19, 2025 – Soitec (Eur...

 PRESS RELEASE

Soitec contribue à l’accélération du développement de solutions de con...

Soitec contribue à l’accélération du développement de solutions de connectivité optique intégrée pour les centres de données dédiés à l’IA grâce à sa technologie Photonics SOI Soitec contribue à l’accélération du développement de solutions de connectivité optique intégrée pour les centres de données dédiés à l’IA grâce à sa technologie Photonics SOI L’industrialisation des solutions de « Co-Packaged Optics » (CPO) s’accélère en vue de leur commercialisation L’intégration directe de la photonique dans les architectures CPO permet jusqu’à 30 % d’économies d’énergie Soitec, un leader du P...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch