NXPIN NXP Semiconductors NV

NXP Accelerates UWB-based Mobile Payment Innovation with NTT DOCOMO and Sony

NXP Accelerates UWB-based Mobile Payment Innovation with NTT DOCOMO and Sony

Demonstration shows secure, convenient hands-free check-out and unique, location-based marketing services

TOKYO, Jan. 14, 2020 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its Ultra-Wideband (UWB) solution will be leveraged for a live mobile payment demonstration by NTT DOCOMO, INC., and Sony Imaging Products and Solutions Inc. (Sony).

With the recent announcement of NXP’s , NXP continues to tie out support from ecosystem leaders across mobile, IoT and automotive makers to cultivate the UWB ecosystem and harness the precise real-time localization capabilities augmented by NXP’s unique, secure UWB portfolio.

The smart retail demonstration orchestrated by DOCOMO and Sony shows intuitive, effortless connectivity experiences using UWB technology and the possibility of its impact and benefit to FeliCa®-based services which spans transportation, in-store payments, building access and more.

“Our demonstration showcases mobile payment, advertisement and smart key applications to present a framework that helps developers, manufacturers and service providers better serve people,” said Takeshi Higuchi, General Manager of Communication Device Development Department at DOCOMO. “We’re excited to collaborate with NXP and Sony to explore more convenient and valuable consumer experiences.”

“NXP has always shared the same vision with us to provide global tourists and mobile phone owners in Japan an integrated, rapid, secure and contactless experience for payment, ticketing, and other popular use cases,” said Toyoaki Kobayashi, Deputy Senior General Manager, FeliCa Business Division at Sony Imaging Products & Solutions Inc. “The demonstrated use cases utilizing fine-ranging capabilities can deliver further benefits derived from FeliCa-based services.”

“DOCOMO and Sony have long demonstrated their innovative leadership in bringing new forms of payment and value-added services to people,” said Charles Dachs, vice president and general manager of Secure Embedded Transactions at NXP. “We’re excited to work with these leaders to demonstrate sophisticated UWB-based use cases that will blend seamlessly into people’s lives.” 

The smart retail demonstration tracks user movement and positioning to showcase the versatile benefits of UWB’s 360 degree positioning, location accuracy of a few centimeters, and spatial context awareness that can be purpose-built for personalized advertising and marketing. Additionally it showcases UWB’s complementary and ubiquitous capability to enhance and interoperate with existing wireless technologies on the narrowband spectrum including Bluetooth Low Energy (BLE) and Near Field Communications (NFC). Embedded with end-to-end secure hardware and software for payment, authentication and identification, the UWB-based showcase includes secure, convenient, hands-free check-out for in-store purchase and drive-through payment experiences. 

SHOWCASE:

The demonstration of UWB-based mobile payment and targeted marketing on digital advertising signs will be demonstrated at DOCOMO Open House 2020 on JAN 23 to 24 in 2020.

LINKS for further information on UWB:

NXP Ultra-Wideband:

Both Sony and NXP are members of the FiRa Consortium, working groups dedicated to the development of seamless user experiences using UWB Technology.

For more information of the FiRa Consortium:

About NXP Semiconductors

NXP Semiconductors N.V. enables secure connections for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 30,000 employees in more than 30 countries and posted revenue of $9.41 billion in 2018. Find out more at .

NXP and the NXP logo are trademarks of NXP B.V. FeliCa is a trademark of Sony Corporation. All other products or service names are the property of their respective owners. All rights reserved. © 2020 NXP B.V.

For more information, please contact:                                                        

AmericasJapan     
Tate Tran Kiyomi Masuda    
Tel: Tel:     
Email: Email:     

A photo accompanying this announcement is available at

 

EN
14/01/2020

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on NXP Semiconductors NV

Pierre FerraguÊ
  • Pierre FerraguÊ

Bible 3Q25 – Autos: Limited near-term visibility, but our cycle thesis...

Today, we are publishing the Automotive section of our 29th Tech Infrastructure Quarterly Bible. The Tech Bible is a must-read for any tech investor, as it summarizes the quarterly earnings reports from the over 140 companies we track, providing an update on our key perspectives and convictions. We will publish sections on Hyperscale & Cloud, Telecom Equipment, Industrials, PCs, Enterprise IT, and Foundry later this week. Auto demand came in above expectations, with limited signs of an air-pock...

 PRESS RELEASE

NXP Semiconductors Announces Quarterly Dividend

NXP Semiconductors Announces Quarterly Dividend EINDHOVEN, The Netherlands, Nov. 19, 2025 (GLOBE NEWSWIRE) -- As part of its ongoing capital return program, NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that its board of directors has approved the payment of an interim dividend. The actions are based on the continued and significant strength of the NXP capital structure, and the board’s confidence in the company’s ability to drive long-term growth and strong cash flow. The board of directors has approved the payment of an interim dividend of $1.014 per ordinary share for the fou...

 PRESS RELEASE

NXP Improves Battery Health Monitoring with EIS Capable Battery Manage...

NXP Improves Battery Health Monitoring with EIS Capable Battery Management Chipset NXP unveils industry-first, battery management system (BMS) chipset with built-in Electrochemical Impedance Spectroscopy (EIS) using precise hardware-based synchronization of all battery cell measurements within a single high-voltage battery packBrings lab-grade diagnostics into vehicles, enhancing battery health insights and expanding NXP’s electrification portfolio with advanced monitoring capabilitiesSimplified and cost-efficient battery cell monitoring allows automakers track battery health, improve elect...

 PRESS RELEASE

NXP Completes Acquisitions of Aviva Links and Kinara to Advance Automo...

NXP Completes Acquisitions of Aviva Links and Kinara to Advance Automotive Connectivity and AI at the Intelligent Edge EINDHOVEN, The Netherlands, Oct. 28, 2025 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) has announced the completion of its acquisitions of , and . On October 24, 2025, NXP closed the previously announced acquisition of Aviva Links for $243 million in cash before closing adjustments. Aviva Links is a provider of Automotive SerDes Alliance (ASA) compliant-in-vehicle connectivity solutions. The Aviva Links acquisition complements and expands NXP’s automotive...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch