NXPIN NXP Semiconductors NV

NXP Accelerates UWB-based Mobile Payment Innovation with NTT DOCOMO and Sony

NXP Accelerates UWB-based Mobile Payment Innovation with NTT DOCOMO and Sony

Demonstration shows secure, convenient hands-free check-out and unique, location-based marketing services

TOKYO, Jan. 14, 2020 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its Ultra-Wideband (UWB) solution will be leveraged for a live mobile payment demonstration by NTT DOCOMO, INC., and Sony Imaging Products and Solutions Inc. (Sony).

With the recent announcement of NXP’s , NXP continues to tie out support from ecosystem leaders across mobile, IoT and automotive makers to cultivate the UWB ecosystem and harness the precise real-time localization capabilities augmented by NXP’s unique, secure UWB portfolio.

The smart retail demonstration orchestrated by DOCOMO and Sony shows intuitive, effortless connectivity experiences using UWB technology and the possibility of its impact and benefit to FeliCa®-based services which spans transportation, in-store payments, building access and more.

“Our demonstration showcases mobile payment, advertisement and smart key applications to present a framework that helps developers, manufacturers and service providers better serve people,” said Takeshi Higuchi, General Manager of Communication Device Development Department at DOCOMO. “We’re excited to collaborate with NXP and Sony to explore more convenient and valuable consumer experiences.”

“NXP has always shared the same vision with us to provide global tourists and mobile phone owners in Japan an integrated, rapid, secure and contactless experience for payment, ticketing, and other popular use cases,” said Toyoaki Kobayashi, Deputy Senior General Manager, FeliCa Business Division at Sony Imaging Products & Solutions Inc. “The demonstrated use cases utilizing fine-ranging capabilities can deliver further benefits derived from FeliCa-based services.”

“DOCOMO and Sony have long demonstrated their innovative leadership in bringing new forms of payment and value-added services to people,” said Charles Dachs, vice president and general manager of Secure Embedded Transactions at NXP. “We’re excited to work with these leaders to demonstrate sophisticated UWB-based use cases that will blend seamlessly into people’s lives.” 

The smart retail demonstration tracks user movement and positioning to showcase the versatile benefits of UWB’s 360 degree positioning, location accuracy of a few centimeters, and spatial context awareness that can be purpose-built for personalized advertising and marketing. Additionally it showcases UWB’s complementary and ubiquitous capability to enhance and interoperate with existing wireless technologies on the narrowband spectrum including Bluetooth Low Energy (BLE) and Near Field Communications (NFC). Embedded with end-to-end secure hardware and software for payment, authentication and identification, the UWB-based showcase includes secure, convenient, hands-free check-out for in-store purchase and drive-through payment experiences. 

SHOWCASE:

The demonstration of UWB-based mobile payment and targeted marketing on digital advertising signs will be demonstrated at DOCOMO Open House 2020 on JAN 23 to 24 in 2020.

LINKS for further information on UWB:

NXP Ultra-Wideband:

Both Sony and NXP are members of the FiRa Consortium, working groups dedicated to the development of seamless user experiences using UWB Technology.

For more information of the FiRa Consortium:

About NXP Semiconductors

NXP Semiconductors N.V. enables secure connections for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 30,000 employees in more than 30 countries and posted revenue of $9.41 billion in 2018. Find out more at .

NXP and the NXP logo are trademarks of NXP B.V. FeliCa is a trademark of Sony Corporation. All other products or service names are the property of their respective owners. All rights reserved. © 2020 NXP B.V.

For more information, please contact:                                                        

AmericasJapan     
Tate Tran Kiyomi Masuda    
Tel: Tel:     
Email: Email:     

A photo accompanying this announcement is available at

 

EN
14/01/2020

Underlying

To request access to management, click here to engage with our
partner Phoenix-IR's CorporateAccessNetwork.com

Reports on NXP Semiconductors NV

 PRESS RELEASE

NXP Semiconductors Reports Fourth Quarter and Full-Year 2025 Results

NXP Semiconductors Reports Fourth Quarter and Full-Year 2025 Results EINDHOVEN, The Netherlands, Feb. 02, 2026 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today reported financial results for the fourth quarter, which ended December 31, 2025. “NXP delivered quarterly revenue of $3.34 billion, surpassing the midpoint of our guidance and reflecting sequential improvement across all end markets. Throughout 2025, we executed effectively despite a challenging first half, maintaining operational discipline while advancing our strategic priorities in software defined vehicles and ...

 PRESS RELEASE

NXP Semiconductors Announces Conference Call to Review its Fourth Quar...

NXP Semiconductors Announces Conference Call to Review its Fourth Quarter and Full Year 2025 Financial Results EINDHOVEN, The Netherlands, Jan. 15, 2026 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced it will release financial results for the fourth quarter and full year 2025 after the close of normal trading on the NASDAQ Global Select Market on Monday, February 2, 2026. The company will host a conference call with the financial community on Tuesday, February 3, 2026, at 8:00 a.m. U.S. Eastern Standard Time (EST). Earnings Conference Call Details Interested pa...

 PRESS RELEASE

NXP Advances Edge AI Leadership with New eIQ Agentic AI Framework

NXP Advances Edge AI Leadership with New eIQ Agentic AI Framework New eIQ Agentic AI Framework enables autonomous agentic intelligence at the edge, adding a new pillar to NXP’s edge AI platformBrings agentic AI to the edge, delivering real-time autonomous decision making for use cases requiring low latency, high reliability and data privacyTrusted foundation for both experienced and new developers to rapidly prototype and deploy agentic AI designs for autonomous edge devices LAS VEGAS, Jan. 06, 2026 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its new eIQ A...

 PRESS RELEASE

NXP and GE HealthCare Accelerate AI Innovation in Acute Care

NXP and GE HealthCare Accelerate AI Innovation in Acute Care Collaboration focuses on the development of two advanced edge AI concepts in anesthesiology and neonatal care designed to help improve patient care. LAS VEGAS and CHICAGO, Jan. 06, 2026 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) and GE HealthCare (NASDAQ: GEHC) today announced a collaboration to pioneer new advancements in edge AI innovation leveraging NXP’s long history in secure, high-performance edge processing and GE HealthCare’s deep experience in medical technology innovation. Beginning with new anesthesi...

ResearchPool Subscriptions

Get the most out of your insights

Get in touch