Amkor Technology, Inc. - September 2019 (LTM): Peer Snapshot
Compares key performance metrics against industry peers.Amkor Technology is a provider of outsourced semiconductor packaging and test services, which include semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The company's Advanced Products include flip chip chip scale packages, wafer-level packages and flip chip ball grid array packages, while its Mainstream Products include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages. The company provides its services to integrated device manufacturers, fabless semiconductor companies and contract foundries.
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