BE Semiconductor Industries : Feedback visite de site : absence d’accélération de l’hybrid bonding en 2023, malgré des perspectives inchangées à LT – OC abaissé à 58 €
>Opinion Neutre réitérée et OC abaissé à 58 € (vs 63 €) à la suite d’une visite de site - Nous avons organisé avec BESI une visite sur son site de 's-Hertogenbosch avec Richard Blickman (CEO) et Leon Verweijen (CFO). Nous retenons un ton optimiste sur les perspectives LT (niveau de confiance élevé sur la pénétration de la technologie hybrid bonding) mais prudent sur la séquence court terme, que ce soit sur le cycle actuel ou sur l’adoption de l’hybrid bonding en 2023 ...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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