BE Semiconductor Industries : L’hybrid bonding accélère sur de multiples fronts et le CMD de juin pourrait être l’occasion de relèvements
>Opinion Surperformance et OC de 100 € réitérés – CMD organisé en juin - Le titre était en hausse de 8% hier, principalement suite à la multiplication de signes positifs concernant l’accélération de la montée en puissance de l’hybrid bonding, qui devrait se matérialiser dès le S2 dans les commandes et plus clairement en 2024. La technologie a atteint des niveaux de performance clé (yield >99%, précision de 100nm permettant d’adresser les puces 3/5nm) et est désormais...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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