BE Semiconductor Industries : Niveau de confiance augmenté sur l’Hybrid Bonding
>Opinion Surperformance et OC à 90 € maintenus - Suite à la publication des résultats du T3 21, nous maintenons notre opinion Surperformance ainsi que notre OC à 90 €. Dans un cycle toujours solide, le groupe devrait continuer de bénéficier de la dynamique du marché de l’Advanced Packaging (sous 7 nm), renforcé par la montée en puissance de l’Hybrid Bonding qui a enregistré de véritables progrès au T3, ainsi que de la poursuite des investissements des grands fondeurs ...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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