BE Semiconductor Industries : Q3 2024 orders well below the consensus, Q4 2024 outlook negatively impacted by shipment delays for HB tools
>Q3 2024 14% below consensus on orders, but slightly above our expectations - BESI reported its Q3 2024 results which were globally above expectations but well below on orders (although slightly above our expectations). Orders were € 152m, up 19% y-o-y due to increased orders for hybrid bonding but down 18% q-o-q primarily due to fluctuations in hybrid bonding order patterns by customers (Intel ordered 26 systems in Q2). They were 14% below the consensus at € 176m but...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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