BE Semiconductor Industries : Reprise plus lente que prévu, accélération de l’hybrid bonding dans la logique, clarification du timing d’adoption dans la mémoire (HBM5)
>Opinion Surperformance réitérée, OC abaissé à 165 € vs 170 € - Le titre BESI était en baisse de 2% hier. Si les commandes T1 et la guidance T2 indiquent clairement une reprise cyclique plus lente que prévu, le groupe a rassuré sur sa dynamique dans l’hybrid bonding et semble en bonne position pour atteindre, voire dépasser les attentes du consensus (107 M€ vs notre estimation à 121 M€ que nous maintenons). Compte tenu d’une reprise plus faible qu’attendu au T2, nous ...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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