BE Semiconductor Industries : Timing d’adoption de l’hybrid bonding dans la mémoire plus incertain, mais cas d’investissement inchangé à LT
>Opinion Surperformance réitérée, OC révisé à 170 € (vs 180 €) - Le titre BESI était en baisse de 16% vendredi en raison d’une crainte que l’adoption de l’hybrid bonding dans la mémoire pourrait se concrétiser plus tard que prévu, suite à un potentiel changement des normes de packaging pour l’HBM4 (pouvant encourager l’utilisation prolongée de la technologie TCB). Cela contraste avec le newsflow récent (article de Digitimes du 23/02). Nous recevions le même jour Richa...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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