BE Semiconductor Industries : Un CMD solide, rassurant sur l’HB et avec de l’upside sur le TCB
>Opinion Surperformance réitérée après un solide CMD – OC relevé à 180 € - Nous retenons de ce CMD 1/ un message rassurant sur l’hybrid bonding et son adoption dans la mémoire (adoption dès 2026-27 vs nos attentes à 2027-28, adoption à 100% de l’hybrid bonding à partir de l’HBM5) ; 2/ le niveau de confiance très élevé du groupe pour gagner des PdM importante dans le TCB, y compris pour l’HBM4 (dynamique non reflété dans le consensus, selon nous) ; 3/ le relèvement de ...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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