BE Semiconductor Industries : What to expect from BESI’s investor day?
>Limited potential for nice surprises but not zero – Outperform rating maintained, € 82 target price unchanged - At its investor day tomorrow (15/06), BESI will, we think: 1/ maintain its guidance for sales of over € 1bn going forward (without upgrading), but 2/ potentially clarify the prospect of hybrid bonding offering upside on this guidance. We note that the consensus expects sales of € 1bn in 2024-2025 (including the contribution from hybrid bonding); 3/ it could...BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Oddo Securities provides securities brokerage and research services. The company offers equity, economic, and derivatives research and credit analysis services. It focuses on insurance, automotive, building materials, pharmaceuticals, telecommunications, information technology, and agri-food industries.
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