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 PRESS RELEASE

STMicroelectronics : Tobii et STMicroelectronics lancent la fabricatio...

STMicroelectronics : Tobii et STMicroelectronics lancent la fabrication en série d’une technologie de détection intérieure révolutionnaire Tobii et STMicroelectronics lancent la fabrication en série d’une technologie de détection intérieure révolutionnaire Début de la production en série d’un système avancé de détection intérieure pour un constructeur automobile européen haut de gamme, en vue d’améliorer la surveillance du conducteur et des passagers. En associant la technologie de détection intérieure de Tobii aux capteurs d’images de ST, cette solution à caméra unique et au coût optimisé...

 PRESS RELEASE

Tobii and STMicroelectronics enter mass production of breakthrough int...

Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology Starting mass production of an advanced interior sensing system for a premium European carmaker for enhanced driver and passenger monitoring Cost-effective single-camera solution combines Tobii's interior-sensing technology and ST’s imaging sensors to deliver wide-angle, high-quality imaging in daytime and nighttime environments Stockholm, Sweden; Geneva, Switzerland – October 2, 2025 -- Tobii, the glo...

Martin Marandon-Carlhian ... (+2)
  • Martin Marandon-Carlhian
  • Stephane Houri
Martin Marandon-Carlhian ... (+2)
  • Martin Marandon-Carlhian
  • Stephane Houri
Pierre FerraguÊ
  • Pierre FerraguÊ

Chinese power semis: Quantifying the risk to Western vendors

Chinese power semiconductor vendors have gained 10pts of global share over the past five years. In this note, we break down where the gains came from, who lost out, and how we expect the competitive landscape to evolve. We also outline the implications for Infineon, onsemi, and STMicro. Please see the link below.

Pierre FerraguÊ
  • Pierre FerraguÊ

Chinese power semis: Where do they gain share? Against whom?

In this one-slider, we break down where Chinese power semi vendors have gained share over the last 5 years, where they’ve struggled, and what’s driving both trends.

 PRESS RELEASE

STMicroelectronics : Le projet STARLight choisi comme consortium europ...

STMicroelectronics : Le projet STARLight choisi comme consortium européen pour piloter la photonique sur silicium de nouvelle génération sur des plaquettes de 300 mm Le projet STARLight choisi comme consortium européen pour piloter la photonique sur silicium de nouvelle génération sur des plaquettes de 300 mm 24 entreprises technologiques et universités de premier plan, représentant 11 pays de l’Union Européenne, unissent leurs efforts, pilotées par STMicroelectronics, pour faire de l’Europe un leader dans le domaine de la technologie photonique sur silicium (SiPho) en 300 mm.Les premières...

 PRESS RELEASE

STARLight Project chosen as the European consortium to take the lead i...

STARLight Project chosen as the European consortium to take the lead in next-generation Silicon Photonics on 300mm wafers STARLight Project chosen as the European consortium to take the lead in next-generation Silicon Photonics on 300mm wafers 24 leading technology companies and universities from 11 EU countries are joining efforts, driven by STMicroelectronics, to establish Europe as a technology leader in 300mm silicon photonics (SiPho) technologyFirst silicon photonics applications-based innovations expected for datacenters and AI clusters, telecommunications, and automotive markets G...

 PRESS RELEASE

STMicroelectronics joins FiRa board, strengthening commitment to UWB e...

STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption STMicroelectronics joins FiRa board, strengthening commitmentto UWB ecosystem and automotive Digital Key adoption Geneva, Switzerland, September 22, 2025 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that Rias Al-Kadi, General Manager of the Company’s Range and Connectivity Division, has joined the board of directors of the FiRa® Consortium, the industry body dedicated to advanc...

TotalEnergies : Sustainability Weekly 15-19 September 2025

Last week, we published a flash note on the latest IEA study on oil and gas field declines. The UN published a report recommending that its member states take legal action against companies involved in the genocide in Gaza. Eurosif, EFAMA and PRI are calling for the establishment of a credible voluntary standard for sustainability reporting for small and mid-cap companies. Norges Bank announced the exclusion of Eramet due to an ‘unacceptable risk that the company contributes to or is responsible...

TotalEnergies : Sustainability Weekly 15 – 19 septembre 2025

La semaine dernière, nous avons publié un flash portant sur la dernière étude de l’AIE sur les déclins des champs pétroliers & gaziers. L’ONU a publié un rapport recommandant à ses Etats membres d’engager des actions en justice contre les entreprises impliquées dans le génocide à Gaza. Eurosif, EFAMA et PRI appellent à la mise en place d'une norme volontaire crédible en matière de reporting sur le développement durable pour les petites et moyennes capitalisations. La Norges Bank a annoncé l'excl...

 PRESS RELEASE

STMicroelectronics to advance next-generation chip manufacturing techn...

STMicroelectronics to advance next-generation chip manufacturing technology with new PLP pilot line in Tours, France PR N°C3358C STMicroelectronics to advance next-generation chip manufacturing technology with new PLP pilot line in Tours, France Multi-disciplinary team to further develop innovative approach to chip packaging and test manufacturing technology boosting efficiency and flexibility Part of ST’s strategic initiative on heterogeneous integration, contributing to technology roadmap on RF, analog, power and digital products Launch of the PLP pilot line in Tours supported by $60 mi...

 PRESS RELEASE

STMicroelectronics introduit la prochaine génération de la technologie...

STMicroelectronics introduit la prochaine génération de la technologie d’assemblage de puces avec une nouvelle ligne pilote PLP à Tours PR N°C3358C STMicroelectronics introduit la prochaine génération de la technologie d’assemblage de puces avec une nouvelle ligne pilote PLP à Tours Une équipe pluridisciplinaire pour développer une approche innovante de la technologie d’assemblage et de test des puces, améliorant l’efficacité et la flexibilitéUne initiative supportant la stratégie de ST sur l’intégration hétérogène, contribuant à la feuille de route technologique pour les produits RF, ...

Martin Marandon-Carlhian ... (+2)
  • Martin Marandon-Carlhian
  • Stephane Houri
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