EQS-News: AT&S Austria Technologie & Systemtechnik AG / Key word(s): Financing/Sustainability AT&S and IFC sign sustainability-linked loan agreement to finance integrated circuit substrate plant in Malaysia (news with additional features) 13.03.2025 / 06:58 CET/CEST The issuer is solely responsible for the content of this announcement. AT&S and IFC sign sustainability-linked loan agreement to finance integrated circuit substrate plant in Malaysia The International Finance Corporation— a member of the World Bank Group —confirmed a 250 million US-dollar loan for AT&S to ...
EQS-News: AT&S Austria Technologie & Systemtechnik AG / Schlagwort(e): Finanzierung/Nachhaltigkeit AT&S und IFC unterzeichnen Vereinbarung für ein nachhaltigkeitsgebundenes Darlehen zur Finanzierung des IC-Substrate-Werks in Malaysia (News mit Zusatzmaterial) 13.03.2025 / 06:58 CET/CEST Für den Inhalt der Mitteilung ist der Emittent / Herausgeber verantwortlich. AT&S und IFC unterzeichnen Vereinbarung für ein nachhaltigkeitsgebundenes Darlehen zur Finanzierung des IC-Substrate-Werks in Malaysia Die Internationale Finanz-Corporation – ein Mitglied der Weltbankgruppe – b...
Our two-day 9th virtual TMT Forum was attended by 32 listed companies and 292 investors. The trends in media seem to point to a correct start to the year. Telecom players are optimistic on the regulatory front (intra-market consolidation). Software & IT services and semis continue to see mixed trends, apart from in AI and some hopes that a few companies will benefit from the rise of defence spending. In terms of companies, the main positive messages came from Auto1, CMCOM, Indra, Infineon, Telec...
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