LAS VEGAS--(BUSINESS WIRE)--
Telechips Inc., an application processor(AP) provider, today announced Dolphin+(TCC803x) chipset, their first ever 14nm finFET, SoC for evolutionary cockpit system. Its AP for In-Vehicle Infotainment(IVI) has been well-known among car OEMs and Tier1s in the automotive industry.
The company will introduce Dolphin+(TCC803x) - processing IVI, Cluster, Head-Up-Display(HUD) and Around-View-Monitor(AVM) in one chipset - for a premium cockpit system at CES2018.
Also, Telechips will showcase all-in-one IVI(including Wireless CarPlay)/HUD on Dolphin(TCC802x), cluster/AVM/connectivity(SDL) on TCC897x, entry-level Cluster on TCC892x and low-end car audio solution with connectivity and digital-radio(DAB/DAB+) on Heron(TCC813x).
Its infotainment solution highlights Wireless CarPlay which will be in mass production with Tier1s in Korea within 2018. Telechips is cooperating with global companies to provide connectivity solutions, such as Abalta’s Weblink and Luxoft’s SDL.
Digital cluster is another solution on which Telechips is focusing and having business discussions with Tier1s in Europe and China. “Customers were impressed with demonstration of digital cluster solution. It boots in 2 seconds (1920x720 at 60fps) which meets customers’ requirement,” said Stanley Kim, VP of Automotive Division.
In addition, Telechips is preparing a complete AVM solution at a competitive price. Dolphin+(TCC803x) supports 4-channels of HD resolution input with MIPI interface for AVM, whereas TCC897x supports 4-channels in SD resolution.
The Dolphin+(TCC803x) is available for sampling in January of 2018 with volume production slated for the 3rd quarter of 2018.
About Telechips, Inc.
Telechips Inc. (KOSDAQ: 054450) is a fabless company headquartered in Seoul with global sites in the US, China, Japan and Singapore. The company has been successful in Automotive and STB industry with its application processors(AP) and communication ICs.
Its automotive AP is expanding applications from In-Vehicle Infotainment(IVI) to the whole cockpit system(IVI, Digital cluster, Head-Up Display, Around View Monitor) with its secure and power-efficiency. Telechips provides chipsets with development environment including reference H/W design, and platforms working with its partners that help Tier1s and OEMs develop efficiently.
Telechips’ secure and powerful AP for Android/Linux/HTML5 based STB&OTT, enabling small footprint and low power consumption, benefits users with new experiences and rich multimedia service scenario.
Telechips and Telechips logo are either registered trademarks or trademarks of Telechips Inc. and its subsidiaries in Korea and other countries. All other trademarks mentioned herein are believed to be trademarks of their respective owners.
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