BESI - Hybrid Bonding adoption by memory delayed?
Last Friday's article from a Korean news site on relaxed thickness specifications for next generation HBM4 suggests part of demand for hybrid bonding tools could be pushed back by several years, as customers can achieve this thickness with cheaper existing technology (TCB).No impact on our estimates (yet) and target price, negative for sentimentBE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
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