Report

PSA Technology: What Now for the Flip Chip Package Makers?

Pelham Smithers discusses the outlook for the flip chip package makers.
Underlyings
Advanced Micro Devices Inc.

Advanced Micro Devices is a semiconductor company. The company primarily provides x86 microprocessors, as standalone devices or as incorporated into an accelerated processing unit, chipsets, graphics processing units (GPUs), data center and personnel GPUs, and development services; server and embedded processors, semi-custom System-on-Chip products, development services and technology for game consoles. The company also licenses portions of its intellectual property portfolio. The company's segments are: Computing and Graphics, which consists of desktop, notebooks, commercial, and chipsets products; and Enterprise, Embedded and Semi-Custom, which includes server processors, and embedded P\processors products.

IBIDEN CO. LTD.

IBIDEN is an electronics related business group based in Japan. Co. operates in two business segments: Electronics segment manufactures and sells printed wiring boards ("PWBs") and package substrates; and Ceramics segment manufacture and sells environment-related ceramics products, graphite specialty products, and ceramics fiber. In addition, Co. manufactures and sells housing equipment and melamine decorative laminates; designs and constructs slopes, garden landscape and environmental facilities. Co.'s other business activities include synthetic plastic processing; agriculture, livestock and fishery processing; oil products sales; information services; automobile transportation and others.

Intel Corporation

Intel is a data-centric company. The company's operating segments are: Data Center Group, which develops platforms for compute, storage, and network functions; Internet of Things Group, which facilitates its customers creating, storing, and processing data; Mobileye, which provides assistance and automation solutions; Non-Volatile Memory Solutions Group, which provides memory and storage products based on Intel? Optane? technology and Intel? 3D NAND technology; Programmable Solutions Group, which provides programmable semiconductors; and Client Computing Group, which connects people to data, allowing each person to focus, create, and engage in ways that unlock their individual potential.

Shinko Electric (6967 JT)

Unimicron Technology Corp.

Unimicron Technology is engaged in the manufacture, processing and sale of printed circuit boards, electrical engineering equipment and materials, electronic products, integrated circuit products testing and preburning systems. Co.'s products include single or multi-layer CSP (chip scale package), BGA (ball grid array), SIP (system in package), Embedded Passive Product, super thin substrate, Flip Chip Substrate, HDI (high density interconnect ) PCB, high layer count PCB (up to 30 layers), Rigid-Flex, CSP (chip scale package used in cell phones and PDA), multiplayer CSP, and PBGA (plastic ball grid array package).

Provider
Pelham Smithers Associates Ltd
Pelham Smithers Associates Ltd

Founded in 2009, Pelham Smithers Associates (PSA) provides market intelligence on Asian technology, focusing in particular on Japan. The industries covered by our team of specialists are: consumer electronics, telecomms, pharmaceuticals, internet, electronic parts and materials, automotive technology, retail and capital goods. 

PSA produces both company and sector reports. The focus of PSA’s research is to identify winners and losers as new technologies impact the top and bottom lines of corporations. Critical to our research is the clear explanation of how these new technologies work and how they impact companies and industries. 

The founding partners have worked closely together for twenty years and the team has more than doubled in size since 2012. 

Analysts
Pelham Smithers

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