Amkor Technology is a provider of outsourced semiconductor packaging and test services, which include semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The company's Advanced Products include flip chip chip scale packages, wafer-level packages and flip chip ball grid array packages, while its Mainstream Products include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages. The company provides its services to integrated device manufacturers, fabless semiconductor companies and contract foundries.
In 2009, just as the dust was settling from the last major equity and credit market crises, we launched a boutique research firm with the intention of breaking Wall Street’s biases and broken incentives:
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Many years later, our business model remains because little has changed on Wall Street.
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