reports
- Pierre FerraguÊ
Broadcom Introduces Industry’s First 800G AI Ethernet NIC
Broadcom Introduces Industry’s First 800G AI Ethernet NIC Thor Ultra is Fully Compliant with Ultra Ethernet Consortium; Delivers Cutting-Edge Performance, Scalability, and Reliability for AI Scale-Out Networking PALO ALTO, Calif., Oct. 14, 2025 (GLOBE NEWSWIRE) -- (NASDAQ:AVGO), a global leader in semiconductor and infrastructure software solutions, today announced Thor Ultra, the industry’s first 800G AI Ethernet Network Interface Card (NIC), capable of interconnecting hundreds of thousands of XPUs to drive trillion-parameter AI workloads. By adopting the open Ultra Ethernet Consortiu...
- Pierre FerraguÊ
Semicon West: 2026 outlook? Does AI drive growth? DRAM architectures? ...
Last week we attended the 2025 edition of the Semicon West conference, the key event for investors focused on the semiconductor equipment market. Over two days we hosted more than a dozen meetings with companies across the semiconductor value chain. Here are our key takeaways.
TSFA TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD. SPONSORED ADR
NVDA NVIDIA CORPORATION
MU MICRON TECHNOLOGY INC.
LRCX LAM RESEARCH CORPORATION
AMAT APPLIED MATERIALS INC.
BSI BE SEMICONDUCTOR INDUSTRIES N.V.
2330 TSMC
SOI SOITEC SA
ASM ASM INTERNATIONAL N.V.
8035 TOKYO ELECTRON LTD.
KLAC KLA CORPORATION
AMD ASML HOLDING N.V.
ASML ASML HOLDING NV
AVGO ADVANCED MICRO DEVICES INC.
SOH1 ASML
BESI BROADCOM INC.
SOITEC
Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powerin...
Broadcom Introduces Industry’s First Wi-Fi 8 Silicon Ecosystem Powering the AI Era New license option to help scale vibrant edge of smartphones, PCs, automotives and IoT devices in support of AI-first access devices PARIS, Oct. 14, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the industry’s first Wi-Fi 8 silicon solutions for the broadband wireless edge ecosystem including residential gateways, enterprise access points, and smart mobile clients. Broadcom’s Wi-Fi 8 solutions are purpose-built to address the stringent performance, reliability, intelligence, and ef...
OpenAI and Broadcom announce strategic collaboration to deploy 10 giga...
OpenAI and Broadcom announce strategic collaboration to deploy 10 gigawatts of OpenAI-designed AI accelerators Multi-year partnership enables OpenAI and Broadcom to deliver accelerator and network systems for next-generation AI clusters News: OpenAI and Broadcom will co-develop systems that include accelerators and Ethernet solutions from Broadcom for scale-up and scale-outBroadcom to deploy racks of AI accelerator and network systems targeted to start in the second half of 2026, to complete by end of 2029 SAN FRANCISCO and PALO ALTO, Calif., Oct. 13, 2025 (GLOBE NEWSWIRE) -- OpenAI an...
- Wedbush Research
WDC WESTERN DIGITAL CORPORATION
TSLA TESLA INC
SIMON SILICON MOTION TECHNOLOGY CORPORATION SPONSORED ADR
PSTG PURE STORAGE INC. CLASS A
NVDA NVIDIA CORPORATION
NTAP NETAPP INC.
MU MICRON TECHNOLOGY INC.
INTC INTEL CORPORATION
AXTI AXT INC.
2330 TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
2303 UNITED MICROELECTRONICS CORP.
PTGX PROTAGONIST THERAPEUTICS
ANAB ANAPTYSBIO INC.
AMD ADVANCED MICRO DEVICES INC.
AAPL APPLE INC.
MSFT MICROSOFT CORPORATION
IBM INTERNATIONAL BUSINESS MACHINES CORPORATION
STTK SHATTUCK LABS
STX SEAGATE TECHNOLOGY HLDGS PLC
GFS GLOBALFOUNDRIES INC
SYRE SPYRE THERAPEUTICS INC.
DBD DIEBOLD NIXDORF INCORPORATED
- Anish Jog
- Daniel Ives
- Matthew Weiss
- Sam Brandeis
- Scott Devitt
Applied Materials and Arizona State University Celebrate Opening of ‘M...
Applied Materials and Arizona State University Celebrate Opening of ‘Materials-to-Fab’ Center TEMPE, Ariz., Oct. 09, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. and Arizona State University (ASU) today marked the official opening of the Materials-to-Fab Center, a shared world-class $270 million research, development and prototyping facility inside the university’s at in Tempe. A ribbon-cutting event was held at the Center as semiconductor industry leaders from around the globe gathered in nearby Phoenix for the SEMICON West conference. Applied Materials executives, including Dr. P...
- Wedbush Research
TSLA TESLA INC
SIMON SILICON MOTION TECHNOLOGY CORPORATION SPONSORED ADR
PSTG PURE STORAGE INC. CLASS A
NVDA NVIDIA CORPORATION
NTAP NETAPP INC.
MU MICRON TECHNOLOGY INC.
INTC INTEL CORPORATION
AXTI AXT INC.
2330 TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
2303 UNITED MICROELECTRONICS CORP.
AMD ADVANCED MICRO DEVICES INC.
AAPL APPLE INC.
ARVN ARVINAS HOLDING
SMCI SUPER MICRO COMPUTER
STX INC.
GFS SEAGATE TECHNOLOGY HLDGS PLC
ZBIO GLOBALFOUNDRIES INC
ZENAS BIOPHARMA INC.
- Antoine Legault
- Matthew Bryson
TSLA TESLA INC
SIMON SILICON MOTION TECHNOLOGY CORPORATION SPONSORED ADR
PSTG PURE STORAGE INC. CLASS A
NVDA NVIDIA CORPORATION
NTAP NETAPP INC.
MU MICRON TECHNOLOGY INC.
INTC INTEL CORPORATION
AXTI AXT INC.
2330 TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
2303 UNITED MICROELECTRONICS CORP.
AMD ADVANCED MICRO DEVICES INC.
AAPL APPLE INC.
SMCI SUPER MICRO COMPUTER
STX INC.
GFS SEAGATE TECHNOLOGY HLDGS PLC
GLOBALFOUNDRIES INC
- Pierre FerraguÊ
Semicap and the $3tn AI bull-case: material upside, but well below the...
We published earlier this week our updated view on the Semicap rally, looking at the implication of AI spending tripling by 2030 for WFE spending. Today, we publish a follow-up looking at the implications of the $3tn AI bull case for Semicap on a single slide.
- Pierre FerraguÊ
Oracle AI cloud margins: Much ado about nothing
The Information reported yesterday that Oracle’s AI cloud margins are in the high teens. Accounting for typical start-up costs, this aligns well with our analysis of the $300bn OpenAI contract. Please see the link for our analysis of Oracle's AI cloud economics over the next 10 years and the implications for overall gross margins.
Broadcom Announces Tomahawk® 6 – Davisson, the Industry’s First 102.4-...
Broadcom Announces Tomahawk® 6 – Davisson, the Industry’s First 102.4-Tbps Ethernet Switch with Co-Packaged Optics Breakthrough 102.4-Tbps CPO Ethernet Switch Delivers Unmatched Power Efficiency and Link Stability to Enable Cluster Scale-Up and Scale-Out PALO ALTO, Calif., Oct. 08, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced that it is now shipping Tomahawk® 6 – Davisson (TH6-Davisson), the company’s third-generation Co-Packaged Optics (CPO) Ethernet switch. Designed specifically for the accelerating demands of AI networking, TH6-Davisson is the industry’s firs...
Broadcom Delivers the Future of AI Infrastructure with End-to-End AI N...
Broadcom Delivers the Future of AI Infrastructure with End-to-End AI Networking Solutions at 2025 OCP Global Summit Company to Feature Industry’s Leading Open, Scalable and Power Efficient Solutions for Scale-up and Scale-out AI Networks PALO ALTO, Calif., Oct. 08, 2025 (GLOBE NEWSWIRE) -- (NASDAQ: AVGO) today announced it will showcase major advancements in its scale-up and scale-out AI networking solutions at the . Featuring innovations such as the Tomahawk® 6, Tomahawk Ultra, Jericho4 Ethernet switches, and its third-generation TH6-Davisson Co-packaged Optics (CPO), Broadcom will pr...
- Wedbush Research
TSLA TESLA INC
GOOGL ALPHABET INC. CLASS A
FB FACEBOOK INC. CLASS A
NFLX NETFLIX INC.
WVE WAVE LIFE SCIENCES
PTGX PROTAGONIST THERAPEUTICS
ANAB ANAPTYSBIO INC.
ROKU ROKU INC. CLASS A
MDB MONGODB INC. CLASS A
AMZN AMAZON.COM INC.
MSFT MICROSOFT CORPORATION
ACET ADICET BIO INC
STTK SHATTUCK LABS
BEAM BEAM THERAPEUTICS
PLTR PALANTIR TECHNOLOGIES
SNOW SNOWFLAKE INC. CLASS A
TTD THE TRADE DESK
PRME INC.
SYRE PRIME MEDICINE INC
JBIO SPYRE THERAPEUTICS INC.
JADE BIOSCIENCES INC
- Anish Jog
- Daniel Ives
- Matthew Weiss
- Sam Brandeis
- Scott Devitt
- Steven Wahrhaftig
Applied Materials Unveils Next-Gen Chipmaking Products to Supercharge ...
Applied Materials Unveils Next-Gen Chipmaking Products to Supercharge AI Performance Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher performance Gate-All-Around transistors at 2nm and beyond by depositing void-free, uniform epitaxial layersPROVision™ 10 eBeam metrology system improves yield of complex 3D chips by providing sub-nanometer resolution, fast throughput and deep imaging SANTA CLARA, Calif., Oct. 07, 2025 (GLOBE NEWSWIRE) -- Applied Ma...
- Pierre FerraguÊ
- Anish Jog
- Daniel Ives
- Matthew Weiss
- Sam Brandeis
- Scott Devitt
- Steven Wahrhaftig
Broadcom Showcases Industry-Leading Quality and Reliability of Co-Pack...
Broadcom Showcases Industry-Leading Quality and Reliability of Co-Packaged Optics Meta Test Results Confirm One Million Link Flap-Free CPO 400G Port Device Hours PALO ALTO, Calif., Oct. 01, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global leader in semiconductor and infrastructure software solutions, today announced a significant milestone in the deployment of Co-Packaged Optics (CPO) technology, highlighting one million cumulative 400G equivalent port device hours of flap-free This achievement underscores the maturity, robustness, and production-readiness of Broadcom’s ...
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