ROHM's Latest 2kV SiC MOSFETs Integrated into Semikron Danfoss' Module for SMA's Large-Scale Power Conversion System Santa Clara, CA and Kyoto, Japan, April 28, 2025 (GLOBE NEWSWIRE) -- today announced that SMA Solar Technology AG, a leading global specialist in photovoltaic and storage system technology, has adopted Semikron Danfoss’ Module featuring ROHM’s latest 2kV SiC MOSFETs for its new large-scale power conversion solution “Sunny Central FLEX.” This modular platform is designed to streamline and enhance grid connections for photovoltaic installations, battery storage systems, and ...
ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated i...
ROHM at PCIM Europe 2025: Powerful Highlights for E-Mobility and Industrial Applications Santa Clara, CA and Kyoto, Japan, April 17, 2025 (GLOBE NEWSWIRE) -- today announced they will participate in PCIM Expo and Conference, the leading international event for power electronics, Intelligent motion, renewable energy and energy management, taking place in Nuremberg, Germany May 6 - 8, 2025. ROHM will exhibit at booth 304 in hall 9, where they will showcase reference projects with renowned partners and present the evolution of its package designs and evaluation boards. "PCIM 2025 in Nure...
ROHM Develops Class-Leading* Low ON-Resistance, High-Power MOSFETs for High-Performance Enterprise and AI Servers Santa Clara, CA and Kyoto, Japan, April 10, 2025 (GLOBE NEWSWIRE) -- has developed N-channel power MOSFETs featuring industry-leading* low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers. The advancement of high-level data processing technologies and the acceleration of digital transformation have increased the demand for data center servers. At the same time, the number of servers equipped with a...
ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers 8-inch design combines an industry-leading 11.67mm height with 7.2V drive for energy-efficient printing Santa Clara, CA and Kyoto, Japan, March 26, 2025 (GLOBE NEWSWIRE) -- today announced the new thermal printhead, compatible with a 2-cell Li-ion battery (7.2V). The product is designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class 11.67mm, contributing to a mor...
ROHM to Showcase Advanced Power Electronics at APEC 2025 Santa Clara, CA and Kyoto, Japan, March 12, 2025 (GLOBE NEWSWIRE) -- U.S.A., LLC, today announced they will participate in APEC 2025, the premier power electronics conference and exposition that brings together power electronics professionals, academics, and students from all over the world. The event will be held from March 16th to 20th in Atlanta, GA. At Booth 1223, ROHM will present its latest power electronics technologies designed to improve power density and efficiency in automotive and industrial equipment applications wh...
ROHM’s EcoGaN Adopted for AI Server Power Supplies by Murata Power Solutions TOLL package 650V GaN HEMTs contribute to improving power supply efficiency Santa Clara, CA and Kyoto, Japan, March 05, 2025 (GLOBE NEWSWIRE) -- today announced that the EcoGaN™ series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions, a subsidiary of the Murata Manufacturing Group and a leading supplier of electronic components, batteries and power supplies in Japan. Integrating ROHM’s GaN HEMTs, which combine low loss operation with high-speed switc...
ROHM Launches 650V GaN HEMT in a Compact, High-heat Dissipation TO-Leadless Package Accelerating development towards the mass production of GaN devices for automotive applications Santa Clara, CA and Kyoto, Japan, Feb. 27, 2025 (GLOBE NEWSWIRE) -- today announced the 650V GaN HEMTs in the TO-Leadless (TOLL) package. Featuring a compact design with excellent heat dissipation, high current capacity, and superior switching performance, the TOLL package is increasingly being adopted in applications that require high power handling, particularly inside industrial equipment and automotive s...
ROHM’s New TVS Diodes: Supporting High-Speed CAN FD In-Vehicle Communication Systems for Autonomous Driving Low-capacitance design prevents signal degradation, while high surge current rating provides enhanced protection for automotive electronic devices Santa Clara, CA and Kyoto, Japan, Feb. 19, 2025 (GLOBE NEWSWIRE) -- today announced new bidirectional TVS (ESD protection) diodes compatible with CAN FD (CAN with Flexible Data rate) high-speed in-vehicle communication. Such protocols are seeing an increased demand in line with the ongoing advancement in autonomous driving and advanced...
ROHM’s New General-Purpose Chip Resistors Contribute to Greater Miniaturization Achieves equivalent rated power in a smaller size with guaranteed stable long-term supply Santa Clara, CA and Kyoto, Japan, Feb. 12, 2025 (GLOBE NEWSWIRE) -- today announced an expanded portfolio of general-purpose chip resistors with the MCRx family, designed to achieve greater miniaturization and enhanced performance across a variety of applications. The new lineup includes the high-power MCRS series and low-resistance, high-power MCRL series. In today's era of advancing functionality and electrificati...
ROHM’s 2nd Generation MUS-IC Series Audio DAC Chip for Hi-Res Audio Playback with Exclusive HD Monaural Mode Delivers an authentic listening experience by expressing the three elements of spatial reverberation, quietness, and dynamic range while preserving the natural “texture” of musical instruments Santa Clara, CA and Kyoto, Japan, Jan. 22, 2025 (GLOBE NEWSWIRE) -- today announced a new 32-bit D/A converter IC (DAC chip) and evaluation board designed for flagship models in the MUS-IC™ series optimized for high-resolution audio playback. Engineered to maximally extract and accurate...
ROHM Offers the Industry’s Smallest Terahertz Wave Oscillation and Detection Devices Price range is less than one-tenth that of conventional devices while achieving remarkable space-savings Santa Clara, CA and Kyoto, Japan, Jan. 15, 2025 (GLOBE NEWSWIRE) -- today announced they have started offering samples of the industry’s smallest terahertz (THz) wave oscillation and detection devices utilizing semiconductor elements known as Resonant Tunneling Diodes (RTDs). Terahertz waves are anticipated to be applied to non-destructive testing, imaging, and sensing in the medical and healthcare ...
ROHM Develops a 1kW Class High Power Infrared Laser Diode 125W × 8ch high-power array significantly improves measurement distance and resolution in LiDAR applications Santa Clara, CA and Kyoto, Japan, Jan. 07, 2025 (GLOBE NEWSWIRE) -- today announced a new high output laser diode - - for use in ADAS (Advanced Driver Assistance Systems) equipped with LiDAR for distance measurement and spatial recognition. ROHM will initially start supplying samples targeting consumer and industrial applications such as drones, robot vacuum cleaners, AGVs (Automated Guided Vehicles), and service robots....
ROHM’s PMICs for SoCs Adopted in Reference Designs for Telechips’ Next-Generation Cockpits Shipments to European automakers scheduled to begin in 2025 Santa Clara, CA and Kyoto, Japan, Dec. 12, 2024 (GLOBE NEWSWIRE) -- today announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs Dolphin3 () and Dolphin5 () by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production ...
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for the Automotive Industry Santa Clara, CA and Kyoto, Japan, Dec. 10, 2024 (GLOBE NEWSWIRE) -- (ROHM) today announced that they have entered into a strategic partnership with TSMC on the development and volume production of gallium nitride (GaN) power devices for electric vehicle applications. The partnership will integrate ROHM's device development technology with TSMC's industry-leading GaN-on-silicon process technology to meet the growing demand for superior high-voltage and high-frequency properties over silicon...
Following the recent results season where several leading semiconductor and SPE companies globally produced either disappointing results or guidance, we look at where the semiconductor industry is at present, where it looks to be headed in 2025 and identify opportunities in the Japanese IC / SPE space.
ROHM’s EcoSiC Technology Adopted in COSEL’s HFA/HCA Series 3.5kW Output AC-DC Power Supply Units Santa Clara, CA and Kyoto, Japan, Dec. 04, 2024 (GLOBE NEWSWIRE) -- today announced the adoption of its EcoSiC™ products, including SiC MOSFETs and SiC Schottky barrier diodes (SBDs) in the HFA/HCA series of 3.5kW output AC-DC power supply units for 3-phase applications from COSEL, a leading power supply manufacturer in Japan. Incorporating ROHM’s SiC MOSFETs and SiC SBDs into the forced-air-cooled HFA series and conduction-cooled HCA series achieves up to 94% efficiency. The HCA series has b...
ROHM Semiconductor and Valeo Co-Develop the Next Generation of Power Electronics Santa Clara, CA and Kyoto, Japan, Nov. 26, 2024 (GLOBE NEWSWIRE) -- and Valeo, a leading automotive technology company, today announced they are collaborating to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack™ to Valeo for future powertrain solutions. Valeo is broadening access to efficient, electrified mobil...
ROHM’s New SiC Schottky Barrier Diodes for High-Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance Achieves approximately 1.3 times the creepage distance compared to standard products Santa Clara, CA and Kyoto, Japan, Nov. 12, 2024 (GLOBE NEWSWIRE) -- today announced new surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models () for automotive applications such as onboard chargers (OBCs), with plans to deploy eight additiona...
ROHM’s New 1200V IGBTs Achieve Industry-Leading Low Loss Characteristics with High Short-Circuit Tolerance Contributes to higher efficiency in automotive electric compressors and industrial equipment inverters Santa Clara, CA and Kyoto, Japan, Nov. 07, 2024 (GLOBE NEWSWIRE) -- today announced new automotive-grade AEC-Q101 qualified 4th Generation 1200V IGBTs that combine class-leading low loss characteristics with high short-circuit resistance. This makes the devices ideal for vehicle electric compressors and HV heaters, as well as industrial inverters. The current lineup includes four...
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